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- M.Mahaney, M.Shell, R.Storde, 1991, Use of the in-process bond shear test for predicting gold wire bond failure modes in plastic packages, IEEE IRPS, pp44-51, 1991. 陈永庆，2005，应用反应曲面方法求解封装焊线制程微细间距之最佳参数，硕士论文，国立中原大学，中坜。
- Error analysis on the X-Y table in automatic gold wire bonder 全自动金丝球焊机X-Y工作台的误差分析
- A Fast Chip Image Locating Algorithm in the Full Automatic Gold Wire Bonder 全自动金丝球焊机中芯片图像快速定位算法
- Keywords image matching;template sampling;candidate subimage;fully automatic gold wire bonder; 图像匹配;模板抽样;候选子图像;全自动金丝球焊机;
- monitoring for gold wire bonding 金丝检测
- Effects of Surface Characteristics on the Bondability of PBGA Soft Gold Wire Bond Pads 表面特性对PBGA软金丝键合点可焊性的影响
- Semiconductor Product category Ultrasonic welding has: Ultrasonic Wire Welder Series, ultrasonic gold wire bonder series, enameled wire electric spot welder series; 超声波半导体焊接产品类有：超声波铝丝焊机系列、超声波金丝球焊机系列、漆包线电点焊机系列；
- gold wire bonder 金丝球引线键合机
- Dicing Saw, Wire Bonder, Die Bonder and Spare Part... 划片机、焊片机、焊线机、上蕊机、封装等二手设备...
- They skillfully stitch at random ,flatting or gold wire way. 她们掌握著乱针、平针、盘金等多种针法。
- Set up an ultrasonic wire bonding laboratory. 成立超声波电子焊接实验室.
- Among them the lowest impedance and the best mechanical quality, it is the first kind type piezoelectric wire bonder. 其中阻抗最低且机械品质最佳的，则是第一种型式的压电打线器。
- Based on the analysis model, the ultrasonic transfer on the horn of wire bonder was studied. 摘要基于解析模型的方法，研究了超声波在热超声金丝球引线键合机变幅杆中的传递规律。
- Keywords: piezoelectric wire bonder, displacement, actuating force, impedance, mechanical quality. 关键字：压电打线器、位移、致动力、阻抗、机械品质。
- THE spiral hair and back light of the Grand Buddha made of the longest gold wire. 这是第一长度的金丝制成大佛的螺发和背光。
- Plasma systems 400 and 660 are low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation. 等离子体400和660系列是低压微波等离子体应用于提高模具粘合，引线的焊接，特别是清洗高级的芯片封装。
- It is composed of a gold wire working electode in glass tube and a saturated calomel reference electrode. 通过实验比较了金管电极与金丝玻管电极检测器的特性。
- Fracture surfaces of gold wire used for bonding semiconductor devices are researched by Scanning Electron Microscope (SEM) and Energy Dispersive Analysis of X-ray (EDX) . 用扫描电镜和X射线能谱仪分析研究了半导体器件键合用金丝的断口。
- Two main production methods for gold wire and their technical characteristics aro stressed. The research situation of substitute materials for gold wire is also introduced. 着重介绍两种主要的生产方法和技术特点;讨论金丝代用材料的研制情况.
- A variant of this phage will even link up with its fellows to form a gold wire many centimeters long, which can be spun like thread and woven into cloth fabric. 其中有一变异株，会与同伴彼此相连，组成长达数公分的黄金丝线。把这些金丝纺成细线，可做为布料的纤维；
