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- front wafer surface 晶片正面
- Scratch - A mark that is found on the wafer surface. 擦伤-晶圆片表面的痕迹。
- Fixed Quality Area( FQA)- The area that is most central on a wafer surface. 质量保证区(qa)-晶圆片表面中央的大部分。
- Fixed Quality Area (FQA) - The area that is most central on a wafer surface. 质量保证区(FQA)-晶圆片表面中央的大部分。
- On the wafer surface the copper ions settle as a thin layer of copper. 电镀完成后，铜离子沉积在晶圆表面，形成一个薄薄的铜层。
- The influences of technology parameters on silicon wafer surface quality when slicing are studied theoretically. 对锯切硅片时各工艺参数对切片表面质量的影响规律进行了理论研究。
- Then, the effect of the working pressure on the flatness of the wafer surface is investigated. 接著，探讨加工压力的大小对于晶圆表面平坦度的影响。
- Etching Area: Etching is to remove the redundancy electric pattern on wafer surface by chemical or physical method. The area where etching is implemented is called Etch Area. 蚀刻区：用化学或物理方法将预先覆盖在晶圆表面上电路图案的多余部分移除的方式称为蚀刻，进行该步骤的区域即为蚀刻区。
- Increasing the wire tension force properly,adopting the higher wire velocity and slower infeed velocity in a range, the high wafer surface quality can be obtained. 适当提高锯丝的张紧力,在一定的变化范围内,采用高的锯丝速度和低的进给速度,可以获得好的切片表面质量。
- The results indicate that all the chelating agents of PAA,HEDP and AMPS can obviously reduce Cu deposition on silicon wafer surface,and the ability to reduce Cu deposition by 83%,79%,44% respectively. 结果表明;PAA、HEDP和AMPS的加入都能明显减少金属铜在硅片表面的沉积量;去除率分别为83%25、79%25和44%25.
- It is indicated that the optimal nonuniformity of wafer surface and material removal rate can be obtained under the wafer and the pad rotating in the same direction with the equal rotational speed. 分析结果表明：硅片与抛光垫转速相等转向相同时可获得最佳的材料去除非均匀性及材料去除率。
- However, as a grooved pad has less contact area for effective interaction with the wafer surface, the average MRR may or may not be increased, depending upon the specific values of process parameters. 而且，由于沟槽的存在，研磨界面间研磨液流量会提升，所以研磨液杂质浓度会降低。
- The diamond and Fullerene abrasive tools with superfine grains were prepared, and the grinding tests on silicon wafer surface was carried out with this two kinds of abrasive tools. 制备了超微粒金刚石和富勒烯研磨工具,并分别进行了硅片研磨试验,详细分析了两种材料的研磨特性如表面粗糙度的稳定性、磨料粒度对研磨效果的影响以及研磨材料的显微结构等。
- The front cover of the novel has been torn off. 这本小说的封面已被撕掉。
- I drove up in front of the house and honked. 我将车开到屋子前面然后按喇叭。
- Silicon wafer surface passivation for solar cell 太阳电池用硅片表面钝化研究
- The driver was ticketed for parking in front of a fire hydrant. 那个司机因把车停在消防栓前而接到交通违规罚单。
- He stood in front of the shop with arms akimbo. 他两手叉腰，站在铺子前。
- There is a rose bush in front of the office. 办公室前有一丛玫瑰。
- She curled up in front of the fire with a book. 她蜷曲在炉火前看书。
