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- Among the three kinds of experimental fluxes the water soluble YH-61 flux is the best flux for Ni-P alloy film, but rosin fluxes of nonactive and modified by bromo-salicylic acid are not suitable for soldering of Ni-P alloy film. 在试验的三种助焊剂中;普通松香和溴化水杨酸改性松香焊剂(SD)不适于Ni-P层的焊接;只有YH-61水溶性焊剂才适于化学镀Ni-P层的焊接.
- flux for solder 焊接用焊剂
- The situation will remain in flux for six months or so. 在半年左右的时间内，局势还会是动荡不定的。
- What is a good method for solder bar addition for lead-free solder bar? 如何才能很好的为无铅焊料棒添加焊料棒?
- Since the core flux carries good workability, it is suitable for soldering where fast wetting is required. 由于芯焊剂具有良好的工作特性,使其适合需要快速熔湿的焊接应用。
- Discuss the welding mechanism and futre research direction on flux for aluminium and its alloy. 同时也对钎剂焊接时的作用机理作了深入探讨,最后阐述了铝及铝合金钎剂的未来研究方向。
- Auto dross clean, adjustable for soldering heigh. 自动拨锡渣;焊锡高度可调整.
- Kester "275" No-Clean Flux for cored solder wire was developed to provide superior wetting performance for hand soldering in the electronics industry. 用于带芯焊锡线的凯斯特"275"免清洗焊剂具有优良的电子行业手工焊接熔湿性能。
- Study of a new flux for lead-free solder paste 无铅焊膏用助焊剂的制备与研究
- Development of No-clean Flux for Lead-free Solder 无铅钎料用免清洗助焊剂的研制
- Adopted antistatic and metal shell is safety for soldering sensitive component. 机身采用高度可靠的全金属防静电模式,焊接敏感组件更安全。
- In-circuit testers can now also test for solder opens on surface-mounted devices (SMDs), a common manufacturing defect on boards with SMDs. 对于表面安装设备来说，焊接开路是一个很普遍的制造缺陷，在线测试设备可以将其测试出来。
- Defects such as bridging, non-wetting, de-wetting and the potential for solder balls can increase. 诸如桥接、不熔湿、反熔湿以及发生焊料结球等缺陷的的可能性可能增加。
- Workmanship requirements for soldered electronic assemblies - Part 1: general. 钎焊电子组件的工艺要求。第1部分:总则。
- Low solids flux for surface mount assemblies designed to help reduce skips on bottom side surface mount pads. 用于表面安装组件的低固态物焊剂,有助于减少表面安装焊盘底侧的遗漏现象。
- Which flux for pure water was 83L/m2 /h, and rejection to BSA was 93% under 0.1 MPa. 在0.;1MPa下;水通量为83L/m~2/h;对牛血清白蛋白的截留率为92%25。
- A special TIG flux for welding mould made of ZA alloy is experimentally developed. 利用试验方法,研制出了一种ZA合金模具TIG焊接专用焊剂。
- Abstract: Fabricating methods often used for solder ball in the BGA package were reviewed.UDS （uniform droplet spray）, which is widely investigated was analyzed. 摘 要: 综合介绍了BGA封装使用锡球常用制造方法，分析了研究较多的均匀颗粒成型技术的原理。
- Main uses：flux for metallurgy、ceramic、glasswork、abrasive substance、foundry、refractory、smelting etc. 主要用途：冶金熔剂、陶瓷、制造玻璃、研磨材料、铸造、耐火材料、冶炼硅铁等。
- A bowl of hot chicken soup is good for you. 喝一碗热鸡汤对你有好处。
