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- Development of advanced electronic package devices promoted the study on the reflow soldering. 先进电子封装器件的出现推动了再流焊方法和设备的研究。
- It is widely used for packing of medicine, food, drinks, stationery, cosmetics, hardware tools and electronic package etc. 本机广泛应用于药品、食品、饮料、文化用品、化妆品、五金工具、电子产品等物品的中包装。
- J. Lau, C. P. Wong, J. L. Prince, W. Nakayama, Electronic Package Design, Materials, Process, And Reliability, (McGraw-Hill), 1998. 黄家纬，“析镀条件对焊锡隆点底层金属无电镀镍之成长与扩散障碍行为之影响”，国立成功大学材料工程研究所硕士论文，2000。
- Jerry's first electronics package was the size of a small refrigerator. 杰里的第一个电子包有一个小型电冰箱那么大。
- With lead-free trend in electronic package,it is necessary to choose lead-free tin-base electrodeposits for electronics industry. 随着电子封装无铅化的趋势,选择无铅锡基镀层已成为必然。
- With lead-free trend in electronic package, it is necessary to choose lead-free tin-base electrodeposits for electronics industry. 摘要随着电子封装无铅化的趋势，选择无铅锡基镀层已成为必然。
- Our HPI TX-2 radio, receiver and servos provide a reliable and trustworthy electronics package. 我们于1946德克萨斯州- 2收音机，接收器和伺服提供一个可靠的和可信赖的电子封装。
- The series features gamers hoping to win $100,000 and the ultimate Samsung electronics package and will also become the “Face of the WCG”. 8集的淘汰类节目。最后的赢家获得10万美金和三星终极电玩包，还会成为WCG代言人。
- Electronic manufacturing consistof semiconductor manufactruing, electronic packaging and assembling. 电子制造包括半导体制造和电子封装与组装。
- Because of the clean layout there is enough room to easily fit any current electronics package, whether brushless or standard brushed system. 因为清洁的布局有足够的空间，很容易适应任何现有的电子封装，是否无刷或标准擦肩而过系统。
- TIANJIN SHUANGLU ELECTRONICS PACKAGING MATERIAL CO., LTD. 天津市双鹿电子元件包装材料有限责任公司。
- The CPC electronic packaging materials have the best integrated properties when annealed under the temperat. 研究了不同退火工艺对轧制复合CPC电子封装材料力学性能、物理性能的影响。
- IGCT integrated gate commutated thyristor (Intergrated Gate Commutated Thyristors) is a giant power electronics package for the new device power semiconductor devices. 留言内容:IGCT集成门极换流晶闸管(Intergrated Gate Commutated Thyristors)是一种用于巨型电力电子成套装置中的新型电力半导体器件。
- Hosted by CIE-CEPS, the International Conference on Electronic Packaging Technology (ICEPT) will celebrate her 10th anniversary this year. 由中国电子学会生产技术学分会(CEPS)主办的电子封装技术国际会议(ICEPT)将迎来第十届庆典。
- Flight Control Electronic Package 飞行控制电子仪器箱
- A new experimental technique on the CTE measurement of metal composite leads in electronic packaging using laser speckle interferometry was presented. 在相对简单的实验设备下,得到较高精度金属复合引线的热膨胀系数值。
- Helen became an electronic engineer. 海伦成了一名电子工程师。
- An unwanted false electronic pulse. 一种不希望有的假电子脉冲。
- This edition also includes coverage of new topics such as nanotechnology, MEMS, electronic packaging, global climate change, electric and hybrid vehicles, and bioengineering. 这个版本还包括涵盖新课题，如纳米技术，微机电系统，电子封装，全球气候变化，电动和混合动力汽车，生物工程。
- The thermal-mechanical reliability of solder joints has been a key issue in the design of electronic devices and the reliability assessment of electronic packaging. 在电子元件的设计和电子封装的可靠性评估中焊点的热-机械可靠性是一个关键的因素。
