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- dice bond technology 焊晶技术
- Eutectic Die Bonding Technology and Its Applications in MEMS Packaging 基于共晶的MEMS芯片键合技术及其应用
- Figure 2 illustrates the fundamental aspects of a die bond. 图2所示为管芯连接的基本结构。
- For the cxample of a 19-meter-span framed girder, this paper expounds the application of prestress with bond technology which is used during the project practice of large-span girder through the discussion on construction and economy. 本文通过某工程 19m跨度框架梁的实例 ,从施工及经济性等方面阐述了有粘结预应力技术在大跨度梁的工程实践中的应用。
- Dicing Saw, Wire Bonder, Die Bonder and Spare Part... 划片机、焊片机、焊线机、上蕊机、封装等二手设备...
- First, design die bond process because Film BGA substrate must overcome warpage issue, next, use TAGU-CHI DOE method, fillet height control was quality characteristic and optimal parameter design. 本文即先从黏晶制程的机台机构上,设计黏晶制程,克服基板翘曲的现象，再使用工业界常使用的田口式品质设计方法，将填充胶的控制列为品质特性，然后最佳化参数设计。
- This product design for IC assembly die attache process on die bonder machine. 本产品为IC集成电路封装工艺芯片全自动固晶机上而专门设计。
- This product design for IC assembly die bonding process on die bonder machine. 本产品是为IC封装自动贴片机及其贴片工艺而设计。
- An equipment for vacuum wafer bonding was developed based on the wafer bonding technology. 摘要基于圆片键合技术，设计了一种在真空条件下进行圆片键合的工艺设备。
- The applications of cryogenic adhesive bonding technology in SQUID non-magnetic Dewar and other fields are introduced. 介绍了低温粘接技术在 SQU ID无磁杜瓦及其它领域中的应用。
- Improve The Die Bond Position Precision 全自动粘片机粘片位置精度提高之方案
- Hence,the new punching bonding technology from TOX company of Germany and its practical application are presented in this paper. 本文介绍了德国TOX公司的一种全新的冲压连接技术及其在实际生产中的应用。
- Some applications of medical adhesives and their bonding technology in the medicine domain were briefly introduced in this article. 简要介绍了医用胶粘剂及其粘接技术在医学领域中的一些应用。
- A preliminary attempt at the application of MATLAB in the study of bonding technology of structural glulam made of Larch is made. 摘要对MATLAB在落叶松结构用集成材胶合工艺技术研究中的应用进行了初步尝试。
- Die bonding is one of the important processes to manufacture the IC components, which must make in the die bonder. 摘要键合是IC元件生产的重要封装过程或工序，需要在芯片键合机上完成。
- You need a strong adhesive to bond wood to metal. 需要强力胶才能把木料粘在金属上。
- Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production. 全自动粘片机是将半导体晶圆微芯片贴装到引线基架的半导体后工序关键性生产设备。
- This glue makes a good firm bond. 这种胶水粘得很结实。
- Common tastes form a bond between the two men. 共同的爱好使两人结交为朋友。
