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- In order to solve the problems such as high copper plating cost,vulnerable oxidation of plate film,non sinter and over sinter which take place in bimetal bush production,a sinter surface technology without copper plate has been studied in this paper. 针对双金属衬套产品生产过程中存在的镀铜成本高、镀层易氧化、烧结易产生漏烧、过烧等实际问题,研制开发了钢板无镀烧结表面处理工艺。
- copper plating film 镀铜膜
- Characteristic: Because of the fine and uniform polishing in CCL, PCB stainless steel, steel plate, resin plate, copper plate, aluminum plate, the adhesion of photosensitive and weld film can be greatly enhanced. 特点：研磨精细，所处理的CCL、pcb不锈钢板、压合钢板、树脂板、铜板、铝板表面精糙度均匀一致，从而能明显提高光敏膜和阻焊磨的附着力。
- The good dispersivity colloids have excellent catalysis for direct copper plating and its UV-VIS peaks are broadened. 分散性好的胶体钯溶液的紫外-可见吸收峰变宽,经过活化可以进行直接电镀。
- Cholride ions in acid copper plating bath were determined by nephelometry with OP emulsifier as stabilizer. 利用比浊法,以OP乳化剂作为稳定剂测定酸性镀铜液中的氯离子。
- Using multi-grade potentiometry to decompose hazardous formic acid in chemical copper plating liquid into CO... 对化学镀铜液中有害的甲酸用多级电位法,使分解为碳酸气与氢。对亚磷酸用过氧化氢氧化为磷酸后呈钙盐去除。
- Electroless copper plating on PET fabrics using hypophosphite as reducing agent was investigated. 研究了采用次磷酸钠作还原剂在涤纶织物上化学镀铜。
- Electroless copper plating is a non-electrolytic method of deposition from solution. 化学镀铜是指不使用电解方法而从槽液中沉积镀铜。
- A new practical process of alkaline non-cyanide copper plating for preventing carburization was introduced. 介绍了一种实用性防渗碳无氰碱性镀铜新工艺,先进行预镀铜,再进行柠檬酸盐镀铜。
- The process flow and conditions of roughening by copper plating for wrought rolled copper foil were introduced. 介绍了压延铜箔镀铜粗化工艺的工艺流程和工艺条件。
- Zinc base die castings are always copper plated in cyanide baths. 锌基合金的压铸件总是在氰化镀液中镀铜。
- P.D dept difinitize plating film technic requirment on 03 headrest staff blueprint.Headrest framework supplier will plate film strict according to the requirement. 开发部在03款头枕杆图纸上明确电镀膜厚技术要求，头枕骨架供应商严格按此要求镀膜。
- Zinc base die castings are always copper plated in cyanide baths . 锌基合金的压铸件总是在氰化镀液中镀铜。
- Specific monoamine may be added as accelerator into electroless copper plating solution to perform high speed deposition. 在化学镀铜液中添加有特效的一元胺作加速剂可以获得特别快的沉积速度.
- With regards to the surface treatment, our crafts include nigrescence, phosphorization, zinc plating, dacromet, nickel plating and copper plating. 表面处理有发黑、磷化、机械镀锌、达克罗、镀镍、镀铜等工艺。
- Hu Yaping,Ji Honghu.Synergetic analysis of velocity and temperature fields of flat plate film cooling[J].Journal of Enginee-Ring Thermophysics,2004,25(1):94-96(in Chinese). [2]胡娅萍;吉洪湖.;平壁气膜冷却流场与温度场的协同分析[J]
- The results prove that the throwing power of the process is better than that of cyanic copper plating, and the deposits h... 结果表明,本工艺的深镀能力优于氰化镀铜工艺,得到的镀层经烘烤和弯曲试验均无脱皮、起泡现象,镀层与基体结合良好。
- The Pd/Sn colloids for direct copper plating have better dispersivity and smaller size than the colloids for electroless. 只有制备出高分散性、粒度小的胶体催化剂,才可以成功实施直接电镀。
- The influences of the intermediate and monomer brighteners commonly used in present acid copper plating on the hardnes... 本文主要对目前国内外常见的酸性镀铜中间体、单体光亮剂对硬度的影响进行了测试研究。
- It is well known that direct copper plating on ABS plastics has found widely industrial application for eliminating electroless plating. ABS塑料直接电镀过程省略了化学镀,是塑料电镀史上的重大突破。
