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- copper foil adhesive 铜箔胶
- Copper Foil Adhesives for Paper Base Copper-Clad Laminates 纸基覆铜箔板专用胶粘剂的研究
- Copper foil tape with acrylic adhesive for specialty EMI/RFI shielding and protection. 铜箔，无导电性压克力胶系，适合用于EMI/RFI遮蔽，可焊锡。
- An epoxy resin adhesive used to flexible circuit copper laminat (FCCL) was prepared, a single-sided FCCL was made from copper foil and polyimide film and the adhesive. 摘要研究了一种用于单面挠性覆铜箔板的环氧树脂胶粘剂，用该种胶粘剂粘接铜箔和聚酰亚胺薄膜制备出单面挠性覆铜箔板(FCCL)。
- It is applicable for the slitting tooling of industrial adhesive tape,cellophanetape,protective film,copper foil,aluminum foil,OPP,PE，PVC，sheet,cloth,ect. 适合分切工业胶带、电子材料，保护膜、铜箔、铝箔、OPP、PP、PE、PVC、纸张、布料等分条加工。
- Uses this product goldfoil, copper foil can not discolorment. 使用本产品金箔、铜箔不会变色。
- This company produces copper foil, aluminous foil, gold foil, and silver foil. 本公司专业生产铜箔、铝箔、金箔和银箔。
- Looking for a Fuser machine for printing with transfer foil. Fuser must make the foil adhesive sticks with toner. If. 寻找转印箔的熔炼机器,熔炼机必须能使箔牢固的粘住颜料。若您能提供请联系我们。
- The Yida Copper Foils Manufacturing Co., Ltd. 亿达铜箔制造有限公司。
- Equivalent heat conductivity of PWB is related to the thickness of PWB,the residual ratio of copper foil and the thickness of copper foil. PWB的等效导热系数与PWB的总厚度、铜箔剩余率及铜箔厚度有关,设计时需考虑相关因素。
- Then, the thickness of copper foil and strand diameter of Litz wire is discussed to obtain the minimum winding losses. 最后针对最小线损下，探讨铜箔厚度及多股绞线直径之最佳设计尺寸。
- When changing Copper Foil spec. (width/ thickness), simply changesthe rollor guider and relevant parts. 铜箔之宽度或厚度变更时;只需更改相关之导轨或配件.
- The process flow and conditions of roughening by copper plating for wrought rolled copper foil were introduced. 介绍了压延铜箔镀铜粗化工艺的工艺流程和工艺条件。
- Various insulating materials such as electronic shield materials,PVC,film,Mylar,copper foil,aluminum foil,foam,etc. 电子屏蔽材料、PVC、胶片、麦拉纸、铜箔、铝箔、泡棉等多种绝缘材料。
- A copper foil solution is used to bond the glass pieces together, and then the pieces are soldered together firmly. 铜箔解决方案可使玻璃碎片结合在一起，然后一起焊接牢固。
- The electrolytic copper foil production for printed circuit board in the world has experienced almost fifty years. 印制电路板用电解铜箔产品在世界上已经历了近五十年的发展历程。
- The ablation process of copper foil with ultrashort laser pulses was simulated by the double-temperature equation(DTE),which was formatted simply. 使用约化后的双温方程(DTE)对超短激光脉冲烧蚀铜薄层的过程进行了数值模拟;
- The ablation processing of copper foil with ultrashort laser pulses was simulated bythe Double-Temperature Equation(DTE), which was formatted simply. 使用约化后的双温方程对超短激光脉冲烧蚀铜薄片的过程进行了数值模拟;
- This article mainly tell the process of electrolysis copper foil surface treatment and changes in Electro-plate layer crystalline forms. 本文阐述电解铜箔表面处理工艺过程与镀层结晶形态的变化。
- Set up in 1955, Yates Foil USA, Inc. was the first company in the world manufactures electrodeposited copper foil for Print Circuit Boards industry. 美国耶兹铜箔公司创始于1955年，是全世界第一家制造电路板的电解铜箔厂。
