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- cathode sputtering process 阴极溅射沉积法
- The source material for a sputtering process. 溅射工艺用源材料。
- A new net-shape cathode sputtering target which has a simple structure and a high sputtering rate was put forward. 设计了一种网状阴极溅射靶,它是由多个空心阴极并列交叉组合而成。
- A new net\|shape cathode sputtering target which has a simple structure and a high sputtering was put forward. 研究设计了一种网状阴极溅射靶,它是由多个空心阴极并列交叉组合而成。
- Its approach is to deposit the CIGS layer using a sputtering process borrowed from the disk-storage industry. 它的方法是通过借鉴于碟片储存行业的“喷溅”处理来沉积CIGS层面。
- Cathode Sputtering in a DC Hollow Cathode Discharge 空心阴极放电的阴极溅射分析
- A special coating system wsa newly developed for metallic film resistors deposited through magnetron sputtering process, which was available to provide low, medium and high-resistance films. 摘要新型磁控溅射电阻镀膜机是在同一台设备上能制作出中、低和高阻值金属膜电阻的专用设备。
- Sputtering process will have the same problem as investment of vacuum equipment and uniformity for large scale. The usage rate & cost of target will affect the future of development. 溅散程序将为大的刻度有真空设备和同样的和投资相同的问题。用法率和目标的费用将影响发展的未来。
- Keywords cathode sputtering;ion sulfo-carbonitriding; 阴极溅射;离子硫氮碳共渗;
- Study on sputtering process of tin oxide 二氧化锡溅射工艺研究
- Sputtering Process for Making EL Films EL薄膜的溅射工艺
- In DC sputtering processes, higher deposition power and lower oxygen partial pressure can increase the percentage of total metallic silver and crystallized silver in thin films. 在直流溅镀制程中，提高镀膜功率与降低氧气分压比例，也可以提高薄膜中总体金属银的比例与结晶银的比例；
- direct current magnetron sputtering process 直流磁控溅射法
- Research of Multiple Hollow Cathode Sputtering Target and Its Application 多重空心阴极溅射靶及其应用
- Effect of sputter process on the wafer fragment 溅射工艺对晶片碎片的影响
- A display device that uses a cathode ray tube. 一种使用阴极射线管的显示装置。
- In RF sputtering processes, it was observed that total metallic silver percentage in thin films was independent of RF power when oxygen partial pressure exceeded some specific value. 但是在射频溅镀制程中，氧气分压比例超过一特定值时，薄膜中银的百分比不会随镀膜功率提高而增加。
- Effect of Magnetron Sputtering Process on Forming of Ti Thin Film 磁控溅射工艺对纳米Ti膜形貌的影响
- SELF-CONSISTENT DESCRIPTION OF A DC HOLLOW CATHODE DISCHARGE AND ANALYSIS OF CATHODE SPUTTERING 空心阴极直流放电的二维自洽模型描述和阴极溅射分析
- INFLUENCE OF SPUTTERING PROCESS ON ITO FILM PERFORMANCE 溅射工艺对ITO膜性能的影响
