Electroless composite plating is one of new surface process techniques. 化學複合鍍是一種新型表面處理技術。
It was also found that liquid hydrophobic agent microcapsules' content in composite copper coating increased with electrodepositing time. 並且隨著電沉積時間的增加，複合鍍銅層中憎水劑微膠囊的數量增加。
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