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- Application and Commercialization of Copper Alloy Lead Frame Materials for Integrated Circuits 集成电路用铜合金引线框架材料的应用及产业化
- alloy lead frame 合金支架
- C194 copper alloy is one of the representative materials of lead frame. C194铜合金是最具代表性的引线框架材料之一。
- Any chamber size are available for customer's Lead frame or strip. 可以制作特殊规格的工作室尺寸。
- Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production. 全自动粘片机是将半导体晶圆微芯片贴装到引线基架的半导体后工序关键性生产设备。
- It can repalace amorphous alloy lead burning material be used as cores for zero-phase current mutual-inductors for leakage switches, in addition magnetic shielding materials. 取代坡莫合金作为漏电开关中的零序电流互感器铁芯,另外可以作为磁屏蔽材料。
- At the same time production of IC lead frame, fluorescent display, VFD display, grid and plastic processing business. 同时生产集成电路引线框架、荧光显示屏、VFD陈列、栅网及塑料加工业务。
- Objective To discuss the application,production,verification and quality assurance of low melting-point alloy lead(LML)in conventional and conformal radiotherapies. 目的探讨低熔点铅挡块的应用、制作、验证及质量保证。
- The lead frame with the opening in die pad can significantly improve the package warpage and die stresses. 导线架晶片座开槽型式，对构装翘曲及晶片应力也有明显改善效果。
- Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production. 粘片机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备。
- Semiconductor manufacturing：reel-to-reel plating, pin plating, lead frame plating, deflashing, Spot plating and electro polishing etc. 半导体元器件电镀：卷对卷电镀，接触器件电镀，引线框架电镀，电抛光，选择性点镀等
- The Quality of lead frame plating layer directly affects the solderability of tantalum capacitor, so its measuring methods are very important. 引线框架电镀层的质量直接影响着钽电容器的可焊性,所以引线框架电镀层质量的测定方法至关重要。
- The ideal requirement for lead frame material properties is that tensile strength, hardness and electrical conductivity are more than 600MPa, 180HV and 80%IACS respectively. 理想的引线框架材料的主要性能为：抗拉强度在600MPa以上，显微硬度大于180HV，导电率大于80%25IACS。
- The results showed that adding 0.2%Sc and 0.1%Zr to Al 5Mg alloy leads to strong grain refinement but adding only 0.2%Sc to Al 5Mg alloy has no grain refinement phenomenon. 结果发现，0?2%25的Sc并未使Al?Mg合金产生晶粒细化作用，而0?2%25的Sc与0?1%25的Zr复合添加则使Al?Mg合金产生了极其强烈的晶粒细化作用。
- The lead frame materials must have high softening temperature because they need to bear short-time high temperature conditions in the process of capsulation. 由于在引线框架材料的后续封装过程中材料需承受短时高温使用条件,所以对其软化温度提出了很高的要求。
- Dealloying is a corrosion process in which one or more elements are selectively removed from an alloy leading to a 3-dimensional porous structure of the more noble element(s). 固化在许多制程中扮演著中重要的角色，而不同的固化过程对生成物的机械性质也有很大的影响。
- The low-profile TLMx100x LED package consists of a reliable lead frame base embedded in a clear epoxy. 超薄TLMx100x封装包含嵌入在清晰环氧树脂中的可靠引线框基盘。
- A FOUND OF ALLOY LEAD AND TIN COINS IN GUILIN 桂林发现铅锡合金钱
- Be involved in part development in non-metal materials, like shader and LED frame housing etc. 参与非金属材料零部件的开发，如遮光罩、模块等。
- The single-sided fish defects of KFC copper alloys applied to lead frame produced by domestic corporation were studied and analyzed by energy spectrum analysis, SEM and metallographic analysis. 对国内某企业采用半连续铸造生产的KFC引线框架带材表面鱼鳞状缺陷进行了分析和研究。
