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- The wafer bumping process in Ball Grid Array (BGA) packaging has three characteristics: long machine setup time, dynamical arrival of orders, and re-entrance of operations. 摘要球格阵列封装厂具有机台整备时间长、订单动态来到以及产品会再回流等三大特性。
- The deadline of the legislation for lead-free,solder paste stencil printing bumping process, electroplating for wafer bumping,UBM,reliability issues and the way ahead are briefly stated in this paper. 本文简要叙述了无铅化立法确定的最后期限、凸点成形工艺、晶圆片凸点成形电镀技术、凸点下金属化及可靠性问题和无铅化材料的发展方向。
- Wafer bumping by electroless nickel and stencil printing 化学镀镍、模版印刷法制备倒扣芯片焊料凸点
- Wafer bumping facing the challenge of Pb-free solder and fine pitch 面对无铅焊料和微细间距挑战的晶圆凸点
- NORTHROP GRUMMAN ANNOUNCES WATER SOLUBLE, WAFER BUMPING SOLDER PASTE NORTHROP GRUMMAN宣布推出水溶性晶片凸块焊锡膏
- How to Use the Thermal Saturation Method to Solve the Reflow Issue in Wafer Bumping Process 如何以热饱和效应克服晶圆凸块回焊制程的问题
- Bumping into you like that is a bit of luck. 这样意外碰见你真是幸运。
- Fundamental Design Issues Affecting the Success of Stencil Printing for Wafer Bumping 影响晶圆凸起网板印刷效果的基本设计事项
- She tripped and went down with a bump. 她绊了一下，猛地跌倒在地上。
- The two children collided with a bump. 两个孩子砰的一声撞上了。
- I really am so sorry to bump into you. 撞着你了真是非常抱歉。
- That bad failure brought them down to earth with a bump. 那次惨重的失败才使他们猛然知道天高地厚。
- Mind you don't bump your head on the low ceiling. 天花板很低，留神别碰头。
- She tripped over a bump on the road. 她被路上一块隆起的地面绊了一下。
- A bump on the head caused her amnesia. 她因头部撞了一下而得了健忘症。
- No man feel like laughing when he bump his funny bone. 没有人在撞伤了笑筋时想要笑。
- A thin, crisp wafer or biscuit, usually made of unsweetened dough. 薄脆饼干一种通常由不含糖的生面团做成的薄脆饼干
- Wafer bumping 凸点制作
- Now people can produce a wafer silicon. 现在人们能够生产一种硅晶薄片。
- When his money ran out, he came down to earth (with a bump). 他把钱用光时，才(赫然)如梦初醒。
