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- Wafer bump voids 晶圆片凸点空洞
- The wafer bumping process in Ball Grid Array (BGA) packaging has three characteristics: long machine setup time, dynamical arrival of orders, and re-entrance of operations. 摘要球格阵列封装厂具有机台整备时间长、订单动态来到以及产品会再回流等三大特性。
- The deadline of the legislation for lead-free,solder paste stencil printing bumping process, electroplating for wafer bumping,UBM,reliability issues and the way ahead are briefly stated in this paper. 本文简要叙述了无铅化立法确定的最后期限、凸点成形工艺、晶圆片凸点成形电镀技术、凸点下金属化及可靠性问题和无铅化材料的发展方向。
- She tripped and went down with a bump. 她绊了一下，猛地跌倒在地上。
- The two children collided with a bump. 两个孩子砰的一声撞上了。
- I really am so sorry to bump into you. 撞着你了真是非常抱歉。
- That bad failure brought them down to earth with a bump. 那次惨重的失败才使他们猛然知道天高地厚。
- Celestials live in the great void. 仙人生活在太虚之中。
- Mind you don't bump your head on the low ceiling. 天花板很低，留神别碰头。
- She tripped over a bump on the road. 她被路上一块隆起的地面绊了一下。
- A bump on the head caused her amnesia. 她因头部撞了一下而得了健忘症。
- He looked down at the gaping void at his feet. 他看着脚下张开的裂缝。
- That subject is void of interest. 那个题目没有趣味。
- The position of secretary is void. 秘书的职位现在空缺。
- Her face was void of all interest. 她面部表情显得对什麽都不感兴趣。
- Wafer bumping by electroless nickel and stencil printing 化学镀镍、模版印刷法制备倒扣芯片焊料凸点
- Wafer bumping facing the challenge of Pb-free solder and fine pitch 面对无铅焊料和微细间距挑战的晶圆凸点
- No man feel like laughing when he bump his funny bone. 没有人在撞伤了笑筋时想要笑。
- The act of making null and void. 废除使 ... 作废和无效
- When his money ran out, he came down to earth (with a bump). 他把钱用光时，才(赫然)如梦初醒。
