The results show that due to diffusion of the elements,a layer of intermetallic compound is formed between these two materials as they are bonded together directly,leading to a 30% strength of the base metal(ZQSn10-10) in joint region.

• 结果表明:Ti-6A l-4V/ZQSn10-10直接扩散连接时,由于母材组元的相互扩散和迁移,在交界面附近形成了金属间化合物层,接头强度仅为母材基体强度的30%25左右。