Superior solderability and resistance to soldering heat. 优良的可焊性及耐热冲击性。
There is good dimensional stability in thickness of board and good resistance of thermal stress of PTH.lon migration among PTH is little. 板的厚度方向的尺寸变化小,金属化孔的耐热冲击性好,板的金属化孔间的耐热离子迁移性好。