您要查找的是不是：
- Flip Chip (FC) technology, which is widely used in IC packaging, is introduced into the fabrication of three-dimensional packaged integrated power electronics module ( IPEM ) to construct Flip Chip IPEM (FC- IPEM). 倒装芯片(Flip Chip,FC)技术广泛应用于微电子封装中,将该技术引入到三维的集成电力电子模块(Integrated Power Electronics Module,IPEM)的封装中,可以构成倒装芯片集成电力电子模块(FC-IPEM)。
- integrated power electronics module (IPEM) 集成电力电子模块
- integrated power electronics module 集成电力电子模块
- INTEGRATED POWER ELECTRONICS MODULE USING FLIP CHIP TECHNOLOGY 倒装芯片集成电力电子模块
- Power Electronics Modules 功率模块
- ShenZhen King Power Electronics Co., Ltd. 深圳市键普电子有限公司。
- Shun Wo New Power Electronics (Shenzhen) Co., Ltd. 信湖新能源电子(深圳)有限公司。
- Electric power electronics product realm. 自动控制仪表等电力电子产品领域。
- AN POWER ELECTRONICS RESEARCH INSTITUTE. 西安电力电子技术研究所。
- IEEE Transactions on Power Electronics. 电力电子学汇刊。
- control system/integrated power electronic module 控制系统／电力电子集成模块
- TIANJIN JINNENG POWER ELECTRONICS CO., LTD. 天津市金能电力电子有限公司。
- PEBB is an integrated concept. It provides a standard for technologies of power electronics devices and their assembly by using interchangeable componects and modules. 电力电子组块(PEBB)是一个集成的概念,以可互换的组件和模块的形式,使电力电子器件和组装技术标准化。
- One BTS can hold as many as twelve TRE electronic modules. 一，输血服务中心可以容纳多达12 tre电子模块。
- Research on A Hybrid Integrated Three-phase Power Electronic Module 混合封装三相桥式电力电子集成模块研究
- Intergrated power electronic module and its applications 模块式电源及其应用
- Heat Transfer in a Hybrid Integrated Power Electronic Module 混合封装电力电子集成模块内的传热研究
- Research and Design of a Half-bridge Integrated Power Electronics Module Based on Wire-bond Technology 一种基于铝丝键合工艺的半桥型电力电子集成模块的研制
- By using the method of modularity to analyse kinds of power electronics control devices, we will find that though they realize kinds of control functions, they all maybe use many the same of modules. 通过用“模块化的方法”对各种电力电子控制装置分析后，发现虽然它们实现的功能不同，但都采用了许多共同的模块。
- Research on EMI Shielding Inside Hybrid Intergrated Power Electronic Module 混合封装电力电子集成模块内电磁干扰的屏蔽
