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- Die bonding technique 贴片工艺
- Figure 2 illustrates the fundamental aspects of a die bond. 图2所示为管芯连接的基本结构。
- The other 12 patients (224 teeth) were carried out with light-cure veneer bonding technique. 在托槽粘结后的四周、八周、十二周分别记录两组患者的托槽脱落率的情况。
- Application of bonding technique in high-duty ferrite phase shifter was mainly introduced. 主要介绍了粘接技术在高功率铁氧体移相器上的应用。
- This product design for IC assembly die bonding process on die bonder machine. 本产品是为IC封装自动贴片机及其贴片工艺而设计。
- Ultrasonic plastic welding (UPW) is a cost-effective, efficient and clean fusion bonding technique of TPC (Thermal Plastic Composites), and of great value in application. 超声波塑料焊接是一种经济、高效、环保的热塑性塑料连接新工艺，有极大的推广应用前景。
- Dicing Saw, Wire Bonder, Die Bonder and Spare Part... 划片机、焊片机、焊线机、上蕊机、封装等二手设备...
- Die bonding is one of the important processes to manufacture the IC components, which must make in the die bonder. 摘要键合是IC元件生产的重要封装过程或工序，需要在芯片键合机上完成。
- This product design for IC assembly die attache process on die bonder machine. 本产品为IC集成电路封装工艺芯片全自动固晶机上而专门设计。
- First, design die bond process because Film BGA substrate must overcome warpage issue, next, use TAGU-CHI DOE method, fillet height control was quality characteristic and optimal parameter design. 本文即先从黏晶制程的机台机构上,设计黏晶制程,克服基板翘曲的现象，再使用工业界常使用的田口式品质设计方法，将填充胶的控制列为品质特性，然后最佳化参数设计。
- bonding technique of integrated circuit 集成电路焊接工艺
- bonding technique for microfluidic chip 微流控芯片的键合技术
- Detection Technique and Performance Analysis of Die Missing for Die Bonding 粘片机中芯片丢失的光敏检测方法及其分析
- This paper introduces a fabricated method of using fused silica as the chip material.It includes standard photolithography, wet chemical etching and bonding techniques. 本文介绍了选用优质石英为芯片基体材料的一种制作方法，关键技术包括标准的光刻，湿法腐蚀，键合等微加工技术。
- Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production. 全自动粘片机是将半导体晶圆微芯片贴装到引线基架的半导体后工序关键性生产设备。
- The auto Die Bonder for SOT-23 transistor is a high-speed, high-precision, machinery-electronics integrated equipment. SOT-23晶体管封装自动键合机是高速、高精度机电一体化精密设备。
- Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production. 粘片机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备。
- We also develop and manufacture some assembly machines such as automatic die bonder and automatic transistor sorter. 另外，公司还开发制造自动粘片机和晶体管测试分选机等封装测试专用设备。
- The Choosing Method For Die Bonding Machine 芯片粘接设备的选择策略
- Die Bonding Equipment Senior Engineer 高级设备工程师
