Depending on the metallization on the board silver (Immersion Silver) or copper (Bare Copper or OSP over Copper) may actually leach into the solder pot.

• 根据线路板上的金属喷镀情况,银(浸银)或铜(裸铜或带有OSP层的铜)实际上可能会析出到焊料槽中。