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- Study of a Novel Freestanding Cu Interconnect Process 制备Cu互连悬空结构的新型工艺研究
- Keywords Cu interconnect;Microstructure;Stress;Electromigration; 关键词铜互连线;微观结构;应力;电徙动;
- In this thesis, we focuse on the microstructure and stress of ULSI Cu interconnects with their impacts on MTF of the electromigration. 本论文主要研究了ULSI中铜互连线的微观结构和应力及其对与电徙动MTF的影响。
- The electron backscatter diffraction technique (EBSD) has been used to measure the microstructure of reactive ion etched(RIE) Al and damascene Cu interconnects, including the grain size, grain orientation and grain boundary characteristics. 利用电子背散射衍射(EBSD)技术;测量了由反应离子刻蚀工艺(RIE)制备的Al互连线和大马士革工艺(Damascene)制备的Cu互连线的显微结构;包括晶粒尺寸、晶体学取向和晶界特征.
- In this paper, the Damascene Cu interconnecting integration technology, low-k dielectric materials and barrier materials in Cu interconnecting integration technology are introduced. 论述了铜互连技术中低k介质材料、势垒层材料以及铜互连布线的大马士革工艺.
- Research and Development of the Cu Interconnect and Its Electromigration Failure 铜互连电迁移失效的研究与进展
- Development of wet processing technique and its application for Cu interconnect in IC industry 集成电路湿法工艺的开发及其在铜内联结构的应用
- The chemical symbol for copper is "Cu". 铜的化学符号是Cu。
- It's strange how people's lives interconnect. 人们的生活是如何互相联系在一起的，真是不可思议。
- Cu interconnect 铜互连
- Development of Diffusion Barrier for Cu Interconnection in ULSI 集成电路Cu互连扩散阻挡层的研究进展
- Tried to interconnect the two theories. 试图融汇贯通这两个理论
- Technology and Slurry of Barrier CMP in ULSI with Cu Interconnection 集成电路多层铜布线阻挡层CMP技术与材料
- You may be too cu ing for one,but not for all. 蒙骗得了一人，但蒙骗不了所有的人。
- F can promote the emission of Pb,Cd,Zn and Cu. 氟会促进Pb,Cd,Zn和Cu的逸放。
- B: Two cu of black coffee, please. 两杯清咖啡，谢谢。
- Most of them are “shi cu” (arrowheads). 其中以石簇的数量最多。
- Cu,Fe and Zn have no obvious relevance to age. 血铜、铁、锌含量不存在显著年龄相关性。
- Cables, NEMA interconnect harness and sockets included. 标准要求的各种电缆和插口包含在内。
- OPC technology is presented to interconnect DCS and MIS. 并通过OPC技术,实现了DCS系统和厂级管理信息系统MIS之间的数据共享。
