Because there is no heat-affected zone and it can achieve high cutting precision, abrasive waterjet is superior to traditional manufacturing, especially in semiconductor industry.

 
  • 由于水射流在加工过程中没有热反应区,可以达到较高的切割精度,特别在半导体行业中,较传统微细加工方法具有无可比拟的优越性。
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