Abstract: Abstract: The status and trend of the IC failure analysis technology in China was reviewed with practical cases, including nondestructive failure analysis, signal tracing, secondary effect, sample preparation and back side failure location.

• 摘要：摘要：通过实例综述了目前国内集成电路失效分析技术的现状和发展方向，包括：无损失效分析技术、信号寻迹技术、二次效应技术、样品制备技术和背面失效定位技术，为进一步开展这方面的工作提供参考。