3. Conduct operation including sampling, mounting, polishing, etching, microscope inspection, hardness testing, NDT testing (magnaflux particles, ultrasonic etc).

• 常规操作包括取样；镶嵌；抛光；腐蚀；显微镜观察；硬度测试；无损探伤(磁粉探伤；超声波探伤等).