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- Analytical Method for the Nickel Release Rate in White Gold Alloys 合金产品中镍释放率的检测方法
- white gold alloy 白色金银合金
- The nib is in white gold and is rhodium-plated. 笔尖为白金且为铑被镀。
- Any gold alloy can be manufactured upon request. 任何黄金合金制成品可以根据请求。
- The white gold setting shows off the beauty of the sapphires. 白金镶嵌更衬托出蓝宝石的美丽。
- White gold diamond earrings are much nicer to your ears. 白金钻石耳环你的。
- White gold diamond earrings are relatively affordable. 白金钻石。白金真的是美妙但对一些敏感肆虐耳环。
- Titanium, white gold, stainless steel, white and black diamonds. 钛,白色金,不锈钢,镶嵌白色和黑色钻石。
- White Gold "Heritage Chronographe" Breguet", Ref. 5460. 参考 5460;成色 1 (新);购买日期 2000's;
- Our stylish "J" earrings begin with high polished 14K white gold. 高度抛光的14K白金耳环有独特的“J”形设计。
- Case : 18k white gold PVD coated with original diamond setting... 石英;女表;所在地: 香港特眊GG誷区, Hong Kong;
- A diamond cut white gold "X" intersects three ribbons of 14K yellow gold. 访钻石切割的白金“X”贯穿了三带式的14K黄金。
- Objective To study the relationship between the depth of abutment undercut and the retention of gold alloy clasp. 目的研究金合金卡环固位力与卡环臂进入基牙倒凹深度间的关系。
- The retention of gold alloy clasp on the molar was greater than that on the premolar in the same condition of undercut. 相同倒凹深度上,磨牙金合金卡环固位力比前磨牙大。
- The etching liquid etches the gold or gold alloy layer existing between the columns evenly. 该蚀刻液均匀蚀刻柱之间存在的金或金合金层。
- Gold and silver separating works, gold alloy, silver alloy, platinum alloy, palladium, palladium... 分类标题:银|贵金属和特种金属...
- White gold necklace with 6 AKOYA pearls, 6 Tahiti pearls and 64 diamonds (1.37 cts). 白金项链,带六颗AKOYA珍珠,六颗塔希提珍珠及64颗钻石(1.;37克拉)
- White gold earring with 4 AKOYA pearls, 2 Tahiti pearls and 16diamonds (0.40cts). 白金耳环,带四颗AKOYA珍珠,两颗塔希提珍珠及16颗钻石(0.;40克拉)
- A series of gold alloy standards applied to analyze major and minor metals in gold jewelry by XRF method have been created in this paper. 本文创造了一套金合金标准,用XRF法分析黄金首饰中的主、次元素。
- The etching liquid etches a gold or gold alloy layer formed on the surface of a substrate for a semiconductor device or a liquid crystal device evenly. 该蚀刻液均匀蚀刻在半导体器件或液晶装置用基片的表面上形成的金或金合金层。