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- Tough and chemical resistance of epoxy resin. 具有环氧树脂的坚硬性耐化学品性。
- wastewater of epoxy resin 环氧树脂废水
- New process on phosphorus curing agents of epoxy resin are reviewed. 摘要综述了含磷环氧树脂固化剂研究的新进展。
- This article studied the properties of epoxy resin modified with oleic acid. 研究了油酸对环氧树脂酸酐固化物性能的影响。
- wastewater from production of epoxy resin 环氧树脂生产废水
- The cathodic electrophoretic coating of epoxy resin was prepared with half blocked isocyanate as curing agent. 在此采用半封闭的甲苯二异氰酸酯作为固化剂制得了环氧树脂阴极电泳涂料。
- The impregnation increment of epoxy resin for carbonized bamboo board with conventional impregnation is low. 采用常规浸渍的方法,炭化竹板的环氧树脂浸渍量低。
- Electron beam curing of various blends of epoxy resin was studied in this paper. 对几种环氧树脂混合体系的电子束固化进行了研究。
- The effects of hyperbranched polymer(HBPE) on mechanical properties of epoxy resin(EP) curing systems were studied. 研究了羟端基脂肪族超支化聚酯(HBPE)对环氧树脂(EP)固化体系力学性能的影响。
- The effect of the different fillers to the anti-corrosion performances of epoxy resin adhesives are also studied. 试验采用的腐蚀介质有自来水、氢氧化钠水溶液、氯化钠水溶液和盐酸溶液。
- This Peper described production and market Situation and future trend of epoxy resin at home and abroad. 阐述了国内外环氧树脂生产和市场情况以及未来预测。
- A latent curing agent of epoxy resin was synthesized and characterized by IR、 elementary analysis and TG. 采用乙二胺与丙烯酸甲酯在乙醇中反应合成了一种具有潜伏性的环氧树脂固化剂。
- The strong demand of epoxy resin and synthesis glycerol promotes the rapid growth of the demand of epoxy chloropropane. 由于环氧树脂、合成甘油等产品需求强劲。促使国内环氧氯丙烷需求量的快速增长。
- The result showed that PABMI made the heat resistance of thermosets increased obviously With the content of epoxy resin in... 结果表明,PABMI使环氧树脂耐热性明显提高,随着环氧树脂比例增加,固化加快,粘结性增大,耐热性降低,建议了不同耐热等级时的原料比例。
- New product of epoxy resin,curing agent,addtive and developing progress in epoxy adhesive,coating and comosite for airliner were introduced. 介绍了环氧树脂、固化剂及助剂方面的新产品以及新型环氧树脂胶粘剂、涂料、大飞机用复合材料等的开发进展。
- Epoxy resin potting compound with high and low temperature resistance for electrical parts consists of epoxy resin, polyamide and polysulfice rubber. 耐高、低温构电器灌封密封胶是由环氧树脂,聚硫橡胶,低分子聚酰胺组成。适合于在恶劣条件下应用的各种电器灌封、密封用。
- Two kinds of the encapsulating processes of epoxy resin are introduced: normality encapsulating and vacuum encapsulating. 介绍了电子产品环氧灌封材料的两种灌封工艺:常态灌封和真空灌封;
- The cationic ultraviolet curing systems and free radical-cationic jumble photo curing systems of epoxy resin were introduced as well. 在光固化技术领域则主要概述了环氧树脂的阳离子紫外光固化体系与自由基-阴离子混杂光固化体系的进展情况。
- Experiment indicated that TPX mould was an ideal plastic mould for casting of epoxy resin which was suitably curing at high or middle temperature. 实验表明它是一种适用于高、中温固化环氧树脂浇铸成型的理想的塑料模具。
- The effect of the typies,amount,adding way of epoxy resin,reaction temperature and the neutralization degree on the properties were investigated. 研究了环氧树脂种类、用量、加料方式、反应温度及中和度等因素对其性能的影响。
