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- Set up an ultrasonic wire bonding laboratory. 成立超声波电子焊接实验室.
- Semiconductor Product category Ultrasonic welding has: Ultrasonic Wire Welder Series, ultrasonic gold wire bonder series, enameled wire electric spot welder series; 超声波半导体焊接产品类有：超声波铝丝焊机系列、超声波金丝球焊机系列、漆包线电点焊机系列；
- Transient Temperature Property of Ultrasonic Wire Bonding Process 超声引线键合过程的瞬态温度特性
- ultrasonic wire bonder 超声线焊机
- Ultrasonic Wire Bond 超声契键合
- Two-dimensional Contact Finite Element Analysis of Ultrasonic Wire Bonding 超声波线焊的两维非接触有限元分析
- Based on the analysis model, the ultrasonic transfer on the horn of wire bonder was studied. 摘要基于解析模型的方法，研究了超声波在热超声金丝球引线键合机变幅杆中的传递规律。
- Keywords nonlinear finite element method;ultrasonic wire bonding;wire bondability;contact pressure; 非线性有限元法;超声波线焊;焊接可能性;接触压力;
- Dicing Saw, Wire Bonder, Die Bonder and Spare Part... 划片机、焊片机、焊线机、上蕊机、封装等二手设备...
- ultrasonic wire bonding 超声波线焊
- Ultrasonic transfer on horn of wire bonder 超声波在引线键合机变幅杆中的传递规律
- Among them the lowest impedance and the best mechanical quality, it is the first kind type piezoelectric wire bonder. 其中阻抗最低且机械品质最佳的，则是第一种型式的压电打线器。
- Keywords: piezoelectric wire bonder, displacement, actuating force, impedance, mechanical quality. 关键字：压电打线器、位移、致动力、阻抗、机械品质。
- Plasma systems 400 and 660 are low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation. 等离子体400和660系列是低压微波等离子体应用于提高模具粘合，引线的焊接，特别是清洗高级的芯片封装。
- M.Mahaney, M.Shell, R.Storde, 1991, Use of the in-process bond shear test for predicting gold wire bond failure modes in plastic packages, IEEE IRPS, pp44-51, 1991. 陈永庆，2005，应用反应曲面方法求解封装焊线制程微细间距之最佳参数，硕士论文，国立中原大学，中坜。
- The ultrasonic bonds, after bonding and aging, of Au wire bonded on the Al metallization pad were analyzed by Scanning Electronic Microscopy(SEM) with Energy Dispersive X-Ray Spectrometer(EDX). 本文采用电子扫描电镜(SEM)及X射线能谱(EDX)分析了Au丝与Al金属化层焊盘键合后在老化过程中界面处元素的分布规律以及化合物的演变过程。
- In addition to improvements in wire bonder hardware, it is necessary to develop a steady wire bonding process which satisfies the requirements for ultra-fine-pitch wire bonding. 目前除了需要不断提高键合机硬件性能外，开发满足超细间距引线键合要求且性能稳定的键合工艺十分必要。
- Fundamental Principles and Methods of Ultrasonic Control in Wire Bonder 键合机中超声波的基本控制原理及方法
- The doctors gave him an ultrasonic brain scan. 医生给他做了脑部超声波扫描检查。
- Therefore, the suspended part of the second substrate does not swing or shake during wire bonding operation. 这样，在打线作业时，该第二基板的悬空部分不会有摇晃或是震荡的情况。
