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- ultrasonic bonding machine 超声焊接机
- Analyse the application of visual system in COG bonding machine. 针对视觉系统在全自动COG热压焊机中的应用进行分析。
- Abstract: This paper reviews the development of ultrasonic bonding transducer, specially the development in China. 文章摘要: 回顾了超声键合用换能器的发展状况，特别是在我国的研究状况。
- The assembly department is having more than 20 assembly lines, 3 sets of bonding machines and 20 sets of ultrasonic welding machines. 装配部有20多条装配线，3套压焊机械和20套超声波焊接机械。
- Applying varieties of work measurement methods, work study on Weiber R6C full automatic linear edge bonding machine of some enterprise was carried through. 摘要应用多种作业测定方法对板式家具生产中使用的威霸R6C全自动直线封边机进行了作业研究。
- Methods used in the study of ultrasonic bonding transducer are summarized, such as equivalent network, direct solution of the vibration and wave equations, and finite element method （FEM）. 对超声键合用换能器的研究方法进行了总结，例如等效网络法、直接解振动与波动方程法、有限元法。
- ZTFB photosensitive seal layer edge bonding machine is a special machine, which uses bonding die cavity to electric perm and spin to avoid ink infiltrate. ZTFB型光敏机印章垫封边机是利用封边模腔对光敏垫周边进行电烫，旋压，使印章与章壳周端边熔为一体，阻止印墨向外渗漏的一种专用机器。
- Applying varieties of work measurement methods,work study on Weiber R6C full automatic linear edge bonding machine of some enterprise was carried through. 应用多种作业测定方法对板式家具生产中使用的威霸R6C全自动直线封边机进行了作业研究。
- A large SMT lines, GRS testing equipment, bonding machine, an independent research and development buildings, perfect after-sales service network products for global sales. 拥有大型的SMT流水线、GRS检测设备、邦定机，拥有独立的研发楼，完善的售后服务网络,产品针对全球销售。
- This product design for IC assembly die bonding process on die bonder machine. 本产品是为IC封装自动贴片机及其贴片工艺而设计。
- Experimental results can be used to model a real ultrasonic bonder and optimize its functions. 这些均有助于键合机换能系统的工艺建模和优化。
- This product design for IC assembly die attache process on die bonder machine. 本产品为IC集成电路封装工艺芯片全自动固晶机上而专门设计。
- Development of Control System Used in Ultrasonic Al Wire Bonding Machine 超声波铝线自动邦定机控制系统的研制
- Ultrasonic Bonding Study of Thick Film Spun Gold and Gold Conductor 厚膜金丝与金导体的超声键合研究
- Non-steady characteristics of ultrasonic bonding transducer system 超声键合换能系统的非稳态特性试验
- The uses of this machine are manifold. 这台机器有多种用途。
- The machine must break down at this busy hour. 正忙的时候，机器偏偏又坏了。
- The ultrasonic bonds, after bonding and aging, of Au wire bonded on the Al metallization pad were analyzed by Scanning Electronic Microscopy(SEM) with Energy Dispersive X-Ray Spectrometer(EDX). 本文采用电子扫描电镜(SEM)及X射线能谱(EDX)分析了Au丝与Al金属化层焊盘键合后在老化过程中界面处元素的分布规律以及化合物的演变过程。
- Microstructure Characteristics at the Ultrasonic Bond Interface 热声键合界面的微观结构特性
- The Choosing Method For Die Bonding Machine 芯片粘接设备的选择策略
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