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- tin coated copper powder 锡包铜粉
- Noriaki,Y Joei,M Takeo.Process for the production of a silver coated copper powder and conductive coating composition[P].US:4 652 465,1987-5-24. 梁浩;解芳.;镀银铜粉导电填料对复合型导电涂料性能影响的研究[J]
- Process and properties of nickel coated copper powder used in electronic industry 电子工业用镍包铜粉的工艺及性能研究
- Bare Copper Wire, Tin Sloder Coated Copper Wire, Jump Wire For P.C.B. Assembly. 产品/营业项目：裸铜线、镀锡铅铜线、跳线。
- nickel coated copper powder 镍包铜粉
- silver coated copper powder 镀银铜粉
- silver- coated copper powder 银包铜粉
- We require 0.6 * 0.6 mm square tin coated HCP wire for energy saving lamp. 如果您是本网注册会员，请登录后查看联系方式。
- nylon 12 coated copper powders 尼龙覆膜Cu粉复合材料
- Lustrousness:tin coating is glossy and not easy to change color. 具有光泽：纯锡镀层有光泽不易变色。
- The resin coated Copper, Bulled up-Multilayer cop environmental protective cop and nonhalogenated flame retardant resin were also introduced briefly. 对涂树脂铜箔、积成法多层覆铜板、环保型覆铜板和无卤阻燃树脂也进行了简要介绍。
- This can lead to the formation of tin whiskers erupting out of the tin coating. 这将导致形成刺出锡涂层的锡晶须。
- The tribological properties and the anti-wear of micron copper powder in greases are investigated by four-ball test. 通过四球试验,考察了微米铜粉在润滑脂中的摩擦学行为和抗磨性。
- Bright tin coating is obtained, and the bath is stable and reliable. 镀液稳定可靠 ,采用本工艺可得到光亮的锡镀层
- During the electrolytic process, ultrasound is introduced to produce nanometer copper powder. 在一定的电解工艺条件下,引入超声波成功制备出纳米铜粉。
- The methods for preparing ultrafine copper powder are described with their advantages and disadvantages given.The developments of these methods are predicted. 阐述了目前制备超细铜粉的方法和工艺,并且对每种方法进行了分析,并就目前的问题提出了展望。
- A new process of electroless tin plating was studied, and half-bright and silvery-white tin coating is obtained. 摘要通过反复试验，研究了一种新型的化学镀锡工艺，获得了半光亮银白色的镀锡层。
- This paper studies oxidation resistance process of using buffer-corrosive on copper powder and finds the best kind and dosage of buffer-corrosive. 研究了使用缓蚀剂对铜粉进行抗氧化处理的工艺,获得了处理效果最好的缓蚀剂类型及最佳使用剂量。
- We get the conclusion that the microstructure evolution of electrolytic copper powder and atomizing copper powder was different in SPS process. 得到电解铜粉和雾化铜粉在SPS烧结过程中显微组织演变特徵和规律不同的结论。
- XRD, SEM, TEM and HRTEM were applied to analyze the phase composition and microstructure, as well as crystal defects in the RPS TiN coating. 利用XRD、SEM、TEM及HRTEM等分析手段研究分析了涂层的结构、微观组织，以及涂层内的晶体缺陷。
