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- The (Pb0.9-xLa0.1Cax)Ti0.975O3(PLCT100x) thin solid films were prepared by Sol-Gel technique. 采用Sol-Gel法制备了(Pb_0.;9-xLa_0
- W. Keppner, R. Wesche, T. Klas, J. Voigt, and G. Schatz, Thin Solid Films 143, (1986) 201. 黄隆玮,"银厚膜表面蒸镀铟、锡后之固液扩散接合研究",中央大学机械所硕士论文,指导教授:林景崎(1999)。
- A. Piotrowska, E. Kaminska, A. Barcz, and J. Adamczewska, Thin Solid Films, Electronic and Optics, 130, 231 (1985). 李正中,“薄膜光学与镀膜技术”,艺轩图书出版社(1999)。
- M. Menning, P. W. Oliveira and H. Schmidt, Thin Solid Films, 351, 99-102 (1999). 剧金兰,张鑫,赵石林,全国第二届奈米材料和技术应用论文集,5,43(2001)。
- M. Menning, P. W. Oliveira, A. Frantzen and H. Schmidt, Thin Solid Films, 351, 225-229 (1999). 罗吉宗,薄膜科技与应用,全华科技图书股份有限公司,(2004)。
- Yosi, S. D., Dubin, V. and Angyal, M., “Electroless copper deposition for ULSI,” Thin Solid Films, Vol. 262, pp. 93-103, 1995. “半导体制程技术导论”,台湾培生教育出版股份有限公司,美国,第473-474页,2001
- T. Arai , H. Fujita , M. Watanabe, “Evaluation of adhesion strength of thin hard coatings”, Thin Solid Films, 154 (1987) 391. 吴明勋,“添加银或钨对氮化铬薄膜磨润性能之影响”,国立成功大学机械工程学系,中华民国92年。
- N. Ozer, Optical and electrochemical characteristics of sol-gel deposited tungsten oxide films: a comparison, Thin Solid Films, 304 pp. 310-314 (1997) . 黄献庆;均匀与组成调制氮化钽薄膜在铜金属化的扩散阻碍性质评估;逢甲大学材料科学与工程研究所硕士论文(2000).
- S.Samukawa, and T.Mukai, “Effects of low-molecular-weight radicals for reduction of microloading in high-aspect contact-hole etching”, Thin Solid Films, 374, 235 (2000). 洪昭南;郭有斌;“以化学气相沉积法成长半导体薄膜”;化工技术;(2000).
- Nichogi, K., Waragai, K., Taomoto, A., Saito Y., and Asakawa S., “Lead Phthalocyanine Langmuir-Blodgett Films,” Thin Solid Films, Vol. 179, pp. 297-301, April, 1989. 萧荣华,“真空蒸镀铜酞花青薄膜及其对二氧化氮气体感测特性之研究”,硕士论文,国立成功大学化学研究所,台南,第15-16页,2004。
- Norikazu, K., Yamada, H., Yajima, T. and Sugiyama, K., Surface properties of activated carbon treated by cold plasma heating, Thin Solid Films, Vol.515, pp. 4192-4196, 2007. 黄龙泰,以稻壳和花生壳制备高表面积之活性碳与其应用,国立台湾科技大学化学工程系,硕士论文,2001。
- Katou, K.;Asou, T.;Kurauchi, Y. and Sameshima, R.“Melting Municipal Solid Waste Incineration Residus by Plasma Melting Furnace with a Graphite Electrode” Thin Solid Films, Vol. 386, pp. 183-188, 2001. 何春松,电浆熔融技术处理焚化炉灰渣之实例探讨,台湾环保产业双月刊,嘉德技术开发,第十九期,2003。
- Fracture of the Solid Film in Thin Solid Film-Liquid Film-Substrate Structure 固体-液体-基底结构中裂纹形貌形成机制
- A Reflection Interference Method for Determining Optical Constants and Thickness of a Thin Solid Film 反射干涉光谱法测量固体薄膜的光学常数和厚度
- Hwan-Chul Lee, Jai-Young Lee,Hyo-Jun Ahn, Thin Solid Film,251(1994)。pp136-140 陈家正,“在微小负荷下不锈钢表面的吸引力和摩擦力之间的关系”,硕士论文,台湾大学,2006。
- Adhesion of Dry Solid Film Lubricants, Method of Test for (05. 干式固体薄膜润滑剂的粘合性的试验方法(05。
- H. S. Randhawa , M. D. Matthews and R. F. Bunshan, Thin Solid Films, 83(1981) 许国铨;"科技玻璃-高性能透明导电膜玻璃";材料与社会;84期;(82);110-119.
- W. D. Brown, W. W. Grannemann, Thin Solid Films, 51, pp 119-132 (1978 陈力俊主编,微电子材料与制程,中国材料科学学会(1999)
- Thomas W. Mountsier, John A.Samuels, “Precursor Selection for Plasma deposited fluorinated amorphous carbon films”, Thin Solid Film 332, 362(1998 李坤翰,“使用矽烷偶合剂及辛氟甲苯为原料之电浆辅助化学气相沉积法制造备低介电膜之研究”,硕士论文,台湾科技大学化工系,2006。
- A thin solid electrolyte film of yttria stabilized zirconia with high den s ity, less porosity was fabricated by this method with 54vol%solid content slurr y. 新型陶瓷与精细工艺国家重点实验室清华大学材料科学与工程系,北京100084;