您要查找的是不是:
- thermal cycling stability 热循环稳定性
- Pb-free solder;BGA;thermal cycling;dynamic fatigue tests;electrical analysis. 关键词:无铅焊锡;球格阵列构装;冷热循环试验;动态疲劳试验;电性分析
- Thermal expand coefficient of polyimide films at each temperature was measured in the process of thermal cycling. 摘要测量了聚酰亚胺薄膜在冷热循环过程中各温度点的热膨胀系数。
- Heating system guarantees the drying of glass because of adopting thermal cycling wind. 采用风机的热循环风,并有加热系统保证了玻璃的干燥度。
- As a result of repeated thermal cycling, fatigue cracks developed in the solder interconnects. 随着热循环周数的增加,焊点中出现疲劳裂纹。
- A multi-system lumped heat capacity analysis has been adopted to simulate the thermal cycling of the micro chamber PCR chip. 本文采用多体系集总热容法分析了微腔型PCR芯片的热循环过程,研究了芯片的温度变化规律,并提出了芯片功耗的预测方法。
- The resulting titanium-vanadium oxide exhibits similar capacity (approximately 400mAh/g), with but better cycling stability than the control sample prepared in the absence of dodecylamine when used as a cathode in lithium batteries. 测试了该氧化物作为锂电池正极材料的性能,发现引入纳米结构极大地提高了材料的充放电稳定性。
- Based on the thermojunction assignment test, actual thermal cycling curve of welded seam heat-affected zone is obtained. 在热电偶标定测试的基础上,通过实验获得了焊缝热影响区的实际热循环曲线。
- With the addition of small amount of B, the cycling stability and activation properties of the alloy electrodes keep almost unchanged, but the maximum discharge capacity (Cmax) decreases. 微量B的加入对合金的循环稳定性能与活化性能影响很小,但降低合金电极的最大放电容量。
- Thermal cycling absorption process(TCAP) in a full reflux mode was studied at different feeding ratios,feeding places and heating/cooling temperatures. 分别在不同进料比、进料位置、加热/冷却温度的条件下,对TCAP工艺的全回流模式进行了实验。
- Thermal cycling absorption process(TCAP),a semi-continuous hydrogen isotope separation process,is of many unique advantages. 对热循环吸附法(TCAP)全回流模式和生产模式下的氕-氘分离实验进行了研究。
- The electrochemical tests indicate that the annealed alloys, as compared with as-cast alloy, show a higher discharge capacity, much better cycling stability and lower high-rate dischargeability. 电化学测试表明, 退火处理后合金的放电容量有所提高, 循环稳定性得到显著改善, 但高倍率放电性能略有降低。
- Dimensional stability of the conventional piston Al alloy ZL109, reinforced with aluminosilicate short fiber, in thermal cycle was investigated. 研究了在热循环条件下,硅酸铝短纤维增强的普通活塞铝合金(ZL109)复合材料的尺寸稳定性。
- Threaded seat rings for valves in services with high velocity (turbulent) flow or thermal cycling should be lock welded to the body to avoid loosening. Please specify. 如果阀门用在高速流体(湍流)或热循环应用环境中,则螺纹阀座环应该锁焊到阀体上,避免松落。请在订购时加以指定说明。
- During thermal cycling, no obvious change of EM was observed but areversible change of EDP was, which is shown to correspond to reversible DO_3-M18R transformation. 在热循环中,衍衬像不发生明显改变,但观察到可逆的电子衍射图变化,分析表明这是可逆的DO_3?M18R型相变。
- However, the solder joint reliability under thermal cycling conditions becomes a critical problem when mounting the WLP onto a PCB when the underfill layer has been eliminated. 然由于晶圆级构装不填注底胶,因此当晶圆级构装于组装PCB基板后承受热循环负载时,焊锡接点可靠度已成为构装结构主要可靠度问题之一。
- The results show that a certain extent oxidation happens on the surface of infiltrated layer when thermal cycling times are less than 20, and no micro-cracks are observed. 结果表明:热循环次数小于20次时,渗层表面出现一定程度的氧化,元微裂纹产生;
- It provides a uniform and void free underfill layer, which gives excellent protection of printed circuit boards from soldering failure due to impact and thermal cycling. 它能形成一致和无缺陷的底部填充层,能有效降低由于硅芯片与基板之间的总体温度膨胀特性不匹配或外力造成的冲击。
- The films exhibited reversible two_color (bright yellow at reduction and dark green at oxidation) electrochromic behavior in alkaline solution with good cycle stability. 当在碱性溶液中对薄膜分别施加阴极和阳极电位时 ;薄膜即呈现由亮黄到深绿的可逆变化 .
- These methods use one or more thermal cycles to produce the desired result. 这些方法是进行一次或多次热循环来产生所需要的结果。