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- Abstract: On the basis investigation of thermal contact resistance developed in the world, the development on thermal contact resistance and thermal conductive filler is briefly introduced. 文摘:在调研国内外接触热阻研究的基础上，介绍了关于接触热阻及接触导热填料的研究发展情况。
- thermal conducting filler 导热填料
- Keywords room temperature vulcanized silicone rubber;thermal conductive filler;thermal conductive mechanism;review; 关键词室温硫化硅橡胶;导热填料;导热机理;综述;
- Keywords silicone rubber;heat conductive filler;thermal conductivity;elastomeric thermal pad; 关键词硅橡胶;导热填料;热导率;弹性导热垫片;
- thermal conductive filler 导热填料
- thermal conducting fillers 导热填料
- Thermal conductivity varies for different gases. 热传导率因不同气体而异。
- Low thermal conductivity,low thermal capacity. 低导热率，低热容量。
- Density of products, and low thermal conductivity. 产品密实性好，导热系数低。
- The thermal conductivity of the wood is poor. 木头的导热性很差。
- Thermal conduct ivity, the ability of a material to t ransferheat energy along its length,w idth, o r th ickness. (热的导电率,材料沿着它的长度、宽度或厚度转移热能源的能力。
- Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler. 以环氧树脂为基体,间苯二胺和二氨基二苯甲烷的低融点混合物为固化剂,铜粉为导电填料,制备了热固化各向同性导电胶。
- JIANG G,GILBERT M,HITT D J,et al.Preparation of nickel coated mica as a conductive filler. 闫军;崔海萍;杜仕国;等.;偶联剂对环氧-铜粉复合导电涂料导电性能的影响[J]
- The results are 1) thermal expansion, and 2) thermal conductivity. 结果导致：1）热膨胀，和（2）热导率。
- Study on thermal conductivity of the YAG and GGG laser crystal[J]. 引用该论文 王保松;江海河;贾先德;张庆礼;孙敦陆;殷绍唐.
- The latest research developments in polymer-based PTC composites filled with carbon series dispersion as a conductive filler agent are reviewed. 摘要总结了碳系分散体（包括碳黑、石墨、碳纤维）作为导电填料镇充聚合物形成聚合物基PTC复合材料的研究进展。
- The results show that there exists great difference between the actual results and the measured results.Heat radiation and thermal conduct have been unanalyzed theoretically. 我们从理论上分析了由于热辐射、热传导影响,得出锥形吸收腔时间温度曲线关系的数学模型;
- Modification of polymer basal body and carbon series conductive filler by grafting and blending is the main direction of current research. 对聚合物基体及碳系导电续料进行共混或接枝改性是当前主要的研究方向。
- Based on the thermal conduct theory and cure kinetics,the history of cure temperature and degree of cure was investigated for the orthotropic laminate during curing. 根据热传导和固化动力学理论,采用三维有限元方法,对正交各向异性复合材料层合板固化过程的温度和固化度历程及其变化规律进行数值模拟研究。
- An electromagnetic shielding conductive coating, based on alkyd resin as binder, copper power as conductive filler, solvents and additives, has been developed. 摘要采用醇酸树脂为基料，金属铜粉为导电填料以及溶剂和助剂，研制成电磁屏蔽导电涂料；
