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- It was found that electrical conducting properties and thermal expansion properties of ceramic specimens closely depend on sintering temperature, Ca2+ substitution and morphological characteristics of La1-xCaxCrO3 powders. 研究结果表明,La_(1-x)Ca_xCrO_3陶瓷的电子导电性能和热膨胀性能与材料的烧成温度、Ca~(2+)含量、粉体的颗粒形态等因素紧密相关。
- La P Q, Xu G J, Ding G T.Study of thermal expansion property for high volume fraction particulate reinforced aluminum matrix composites [J].Acta Materiae Compositae Sinica, 1998, 15(2): 6-11. [6]喇培清;许广济;丁广田.;高体积分数粒子型铝基复合材料热膨胀性能的研究[J]
- Study on the Thermal Expansion Properties of Flexible Mold Material for RTM Process 用于RTM工艺的软模材料的热膨胀性能
- thermal expansion properties 热膨胀性能
- Thermal expansion of a monatomic nanochain[J]. 引用该论文 黄建平;吴学忠;李圣怡.
- Theoretical prediction and experimental study on linear thermal expansion property of SF-TPU composite SF-TPU复合材料线热膨胀性能研究
- Metals are elements that can be defined by their properties,such as ductility,toughness,malleability,electral and heat conductivity,and thermal expansion. 金属是根据可锻性,刚性,可塑性,电热导通性以及热膨胀度等特征来定义的多种元素的复合物。
- The results are 1) thermal expansion, and 2) thermal conductivity. 结果导致:1)热膨胀,和(2)热导率。
- Advanced technical ceramics - Ceramic composites - Thermophysical properties - Part 1 : determination of thermal expansion. 高级工业陶瓷.;陶瓷复合材料
- High viscosity, highly filled epoxy formulation which, in addition to having excellent electrical properties, has unusually high thermal conductivity with low thermal expansion. 高粘度,高填充环氧树脂,有着良好的电气性能,高导热,低热膨胀。
- The influences of lithia content on the melting temperature,mechanical properties and thermal expansion coefficient of low temperature frit were studied. 本文研究了氧化锂加入量对低温熔块的熔融温度、力学性能、热膨胀系数的影响。
- The effect of mullite fiber on the mechanical properties of AT ceramics was studied by means of XRD, SEM, thermal expansion coefficient, bending strength and porosity. 利用X射线衍射、扫描电镜、热膨胀系数、抗弯强度和气孔率测试等手段,研究了莫来石纤维对钛酸铝陶瓷力学性能的影响。
- Epoxy resin, which has properties of low thermal expansion and high insulation, has been widely used as interlayer dielectrics, packaging materials, and circuit boards. 环氧树脂具有高绝缘、热膨胀小等优点,在微电子行业被广泛用作层间介质、封装材料、印刷电路板等。
- The principle of the indirect temperature measurement uses the defined expansion properties of an inert gas in a closed system. 非直接温度测量的原理利用了封闭系统中惰性气体的膨胀规律。
- The thermal expansion of liquids is the principle of operation here. 液体温度计的原理是液体的热膨胀。
- Thermal expansion of cementite and thermoelastic stresses in white cast iron . pdf 提供几篇相关资料,不知道有没有人需要。
- The strength and expansion properties are mainly determined by the content of C3S and C4A3S in the clinker and the addition of gy psum in cement.The flash setting behavior can ... 水泥强度、膨胀等性能主要取决于熟料中C3S和C4A3S含量及水泥中石膏掺量(可用石灰石部分代替石膏作缓凝剂)。
- It is difficult to estimate thermal expansion as a result of surface warming. 因表面受热而引起的热膨胀难以估算。
- To match with the spinel, a low temperature frit glass and funnel glass with similar thermal expansion are developed. 分析了封接中材料匹配、浸润性以及再结晶等原理,叙述了封接工艺。
- Spinel exhibits a lower thermal expansion coefficient than conventional glass faceplate. 给出了封接结构、所用屏、低熔点玻璃和锥的材料特性。