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- thermal cycling parameter 热工参数
- Pb-free solder;BGA;thermal cycling;dynamic fatigue tests;electrical analysis. 关键词:无铅焊锡;球格阵列构装;冷热循环试验;动态疲劳试验;电性分析
- Effect of thermal cycling on the martensite transformation and two way shape memory effect (TWSME)in Cu-Zn-Al alloys in studied by means of transformation parameter measurement ,optical metalloscope observationand X-ray diffraction. 利用相变参数测量、变温金相观察、X-射线衍射等方法研究了热循环对Cu-Zn-Al合金马氏体相变和双向记忆效应的影响。
- Thermal expand coefficient of polyimide films at each temperature was measured in the process of thermal cycling. 摘要测量了聚酰亚胺薄膜在冷热循环过程中各温度点的热膨胀系数。
- Heating system guarantees the drying of glass because of adopting thermal cycling wind. 采用风机的热循环风,并有加热系统保证了玻璃的干燥度。
- As a result of repeated thermal cycling, fatigue cracks developed in the solder interconnects. 随着热循环周数的增加,焊点中出现疲劳裂纹。
- Effects of thermal cycle parameters and substrate dimensions on solder joint reliability 热循环参数及基板尺寸对焊点可靠性的影响
- A multi-system lumped heat capacity analysis has been adopted to simulate the thermal cycling of the micro chamber PCR chip. 本文采用多体系集总热容法分析了微腔型PCR芯片的热循环过程,研究了芯片的温度变化规律,并提出了芯片功耗的预测方法。
- Based on the thermojunction assignment test, actual thermal cycling curve of welded seam heat-affected zone is obtained. 在热电偶标定测试的基础上,通过实验获得了焊缝热影响区的实际热循环曲线。
- Thermal cycling absorption process(TCAP) in a full reflux mode was studied at different feeding ratios,feeding places and heating/cooling temperatures. 分别在不同进料比、进料位置、加热/冷却温度的条件下,对TCAP工艺的全回流模式进行了实验。
- Thermal cycling absorption process(TCAP),a semi-continuous hydrogen isotope separation process,is of many unique advantages. 对热循环吸附法(TCAP)全回流模式和生产模式下的氕-氘分离实验进行了研究。
- Threaded seat rings for valves in services with high velocity (turbulent) flow or thermal cycling should be lock welded to the body to avoid loosening. Please specify. 如果阀门用在高速流体(湍流)或热循环应用环境中,则螺纹阀座环应该锁焊到阀体上,避免松落。请在订购时加以指定说明。
- During thermal cycling, no obvious change of EM was observed but areversible change of EDP was, which is shown to correspond to reversible DO_3-M18R transformation. 在热循环中,衍衬像不发生明显改变,但观察到可逆的电子衍射图变化,分析表明这是可逆的DO_3?M18R型相变。
- However, the solder joint reliability under thermal cycling conditions becomes a critical problem when mounting the WLP onto a PCB when the underfill layer has been eliminated. 然由于晶圆级构装不填注底胶,因此当晶圆级构装于组装PCB基板后承受热循环负载时,焊锡接点可靠度已成为构装结构主要可靠度问题之一。
- The results show that center segregation deteriorates the impact toughenss of center part and the parameter of welding thermal cycle has different effect on toughenss of steel. 试验结果表明,中心偏析恶化了连铸钢中心部位冲击韧度,焊接热循环参数对冲击韧度有较大影响。
- The results show that a certain extent oxidation happens on the surface of infiltrated layer when thermal cycling times are less than 20, and no micro-cracks are observed. 结果表明:热循环次数小于20次时,渗层表面出现一定程度的氧化,元微裂纹产生;
- It provides a uniform and void free underfill layer, which gives excellent protection of printed circuit boards from soldering failure due to impact and thermal cycling. 它能形成一致和无缺陷的底部填充层,能有效降低由于硅芯片与基板之间的总体温度膨胀特性不匹配或外力造成的冲击。
- It is conceivable and probable that each will have its own cycle parameters. 这些变量包括冷冻速率和温度斜率。
- "Z( j2 h7 E0 Q z* ?Threaded seat rings in valves in services with high velocity (turbulent) flow or thermal cycling should be lock welded to the body to avoid loosening. 当用于高速流体(湍流)或热循环应用时,为了避免松开,螺纹阀座环应该锁焊在阀体上。
- These methods use one or more thermal cycles to produce the desired result. 这些方法是进行一次或多次热循环来产生所需要的结果。