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- solder joint strength test 焊锡连接强度试验
- Tensile strength test and SEM analysis of the soldered joint fralture were carried out to elucidate the effect of thermal cycling on tensile strength and microstructure of QFP soldered joint. 焊点强度试验以及断口SEM分析,初步揭示了热循环对QFP焊点抗拉强度及焊点组织的影响规律。结果表明,裂纹在焊点内侧钎料与焊盘界面处产生。
- Joint strength test for plaster board light steel profile system 纸面石膏板轻钢龙骨系统接缝强度试验
- The solder joint exceeds the strength of Type L tube in annealed temper. 这种焊料连接超过退火处理类型L管道的强度。
- Methods of the strength tests for brazed and soldered joint 钎焊接头强度试验方法
- Solder end valves are limited by temperatures which affect the strength of the solder joint. 焊接连接端口阀门温度限制在不影响焊接连接端口的强度范围内。
- Solder joint fatigue life is generally ascertained through accelerated temperature cycle test on electrical subassembly. 焊点疲劳寿命通常是通过电子组件进行温度循环加速试验来确定。
- Research effect of different ROL on pulling strength of QFP solder joint mainly in order to get the proper range of ROL. 主要研究了不同氧含量对QFP引脚焊点拉伸强度的影响,得到一个最佳的氧含量范围。
- Concrete bending tensile strength test machine. 混凝土抗折机。
- S. Ahat, M. Sheng, and L. Luo, “Microstructure and shear strength evolution of SnAg/Cu surface mount solder joint during aging”, J. Electron. Mater., Vol.30, p.1317 (2001). 游善溥，“锡锌系无铅焊锡与铜基材间附著性与界面反应之研究”，博士论文，成功大学材料科学及工程学系，第一章，第13页，(2000)。
- Therefore, it is necessary to study the reliability of this mixed solder joint. 因此，有必要对这种混合焊点进行可靠性分析。
- Therefore,it is necessary to study the reliability of this mixed solder joint. 因此,有必要对形成的混合焊点进行可靠性分析。
- Standard forms for concrete bending tensile strength test cube. 混凝土抗折试模。
- Standard forms for concrete compressive strength test cube. 混凝土抗压试模。
- Standard forms for grout compressive strength test cube. 砂浆试模。
- Saponifier formulations, without proper inhibitors, may attack some metal surfaces, resulting in a dull solder joint. 皂化剂中所含成分，若不采用适当的抑制剂，将会侵蚀金属表面，造成焊点钝化。
- For a high-complexity board with more than 30,000 solder joints, a test strategy of AOI, AXI and ICT before functional test may be most cost-effective. 对于焊点大于30000个的高复杂性印板，在功能测试之前进行AOI、AXI和ICT等测试的方案，会是成本效果最佳的。
- This paper discusses the factors of influencing thermal fatigue of solder joint in SMT and its research method. 本文研讨了影响SMT焊接点热疲劳性能的因素及研究方法。
- For flexural strength test of cement specimen and other nonmetallic material. 用作水泥或其它非金属脆性材料试块的抗折强度测定。
- The results show that the residual moisture within underfill materials enhances the stress level in solder joint. 结果表明：在湿热环境下，底充胶材料内部残留的湿气提高了焊点的应力水平。
