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- solder joint defects 焊点缺陷
- Therefore, it is necessary to study the reliability of this mixed solder joint. 因此，有必要对这种混合焊点进行可靠性分析。
- Therefore,it is necessary to study the reliability of this mixed solder joint. 因此,有必要对形成的混合焊点进行可靠性分析。
- The solder joint exceeds the strength of Type L tube in annealed temper. 这种焊料连接超过退火处理类型L管道的强度。
- It is shown that 96.8 percent of defects inside solder joints are inspec-ted successfully. 结果表明;对盘焊缺陷的检测成功率达96.;8%25。
- Solder end valves are limited by temperatures which affect the strength of the solder joint. 焊接连接端口阀门温度限制在不影响焊接连接端口的强度范围内。
- Saponifier formulations, without proper inhibitors, may attack some metal surfaces, resulting in a dull solder joint. 皂化剂中所含成分，若不采用适当的抑制剂，将会侵蚀金属表面，造成焊点钝化。
- This paper discusses the factors of influencing thermal fatigue of solder joint in SMT and its research method. 本文研讨了影响SMT焊接点热疲劳性能的因素及研究方法。
- The results show that the residual moisture within underfill materials enhances the stress level in solder joint. 结果表明：在湿热环境下，底充胶材料内部残留的湿气提高了焊点的应力水平。
- Important procedures for preparing a solder joint are graphically illustrated in this catalog on page 48. 焊料连接准备工作的重要步骤在本样本第48页中有图文并茂的描述。
- The quality of solder joint affects the reliability and lifetime of the products produced by SMT directly. 摘要由表面组装技术(SMT)形成的产品，其焊点质量直接影响到产品的可靠性和寿命。
- The quality of solder joint affects the reliability of the products produced by SMT directly. 由表面组装技术(SMT)形成的产品,其焊点质量直接影响到产品的可靠性。
- The solder will be dull looking and, if the gold content in the solder exceeds about 5%, the solder joint will be brittle. 焊点外观将变得暗淡,此外,如果焊料中的金成分超过约5%25时,焊点将会变脆。
- New developments in flux chemistries for lead-free pastes do not require nitrogen to achieve good wetting and solder joint integrity. 无铅焊锡膏的焊剂化学的新发展可以做到不使用氮气也可得到良好的熔湿性和焊点完整性。
- Under temperature cycling (thermomechanical fatigue) conditions, this Pb-rich phase tends to coarsen and eventually leads to solder joint cracking. 在温度循环条件（即热机械疲劳条件）下，富铅相会变粗并最终导致焊点破裂。
- Solder joint fatigue life is generally ascertained through accelerated temperature cycle test on electrical subassembly. 焊点疲劳寿命通常是通过电子组件进行温度循环加速试验来确定。
- Solder Joint - NIBCO pioneered the development of the solder joint and its application to the field of copper tube piping. 焊料连接-美国尼伯科公司是开发焊料连接方式的先驱者，并将这种连接方式应用到铜管管道领域。
- Keywords First carpometacarpal joint Defect Repair; 第1腕掌关节;缺损;修复;
- Whether fatigue of solder joint and the location of the chip are related to the curvature and torsional curvature of PCB are discussed. 芯片焊点寿命的长短和芯片所处位置的曲率和扭率都有关系,但是扭率对寿命的影响总是被忽略。
- Research effect of different ROL on pulling strength of QFP solder joint mainly in order to get the proper range of ROL. 主要研究了不同氧含量对QFP引脚焊点拉伸强度的影响,得到一个最佳的氧含量范围。
