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- Adapted to the reflow soldering. 适应于回流焊接。
- Reflow solder paste in 2 hours as soon as possible after printing. 印刷后要在2小时内回流焊膏。
- Compatible with infrared and vapor phase reflow solder process. 适用于回流焊接工艺。
- Peak soldering reflow temperature also impacts cleaning performance. 再流焊的峰值温度也会对清洗性能造成影响。
- solder reflow soldering 回流锡焊
- In SMT reflow soldering process,profiling a PCBA is a extremely important step. 在SMT回流焊的整个流程中，为组装电路板设定合适的温度分布曲线是十分重要的一个环节。
- No-flow underfill materials that cure during the solder reflow process is a relatively new technology. 在精细金属线条的连铸过程中，影响铸件品质的因素很多，所以有必要对不同的操作条件作影响评估。
- What other issues can be expected with the conversion to lead-free reflow soldering? 转变到无铅回流焊接还会遇到什么问题?
- Lead-free wave soldering, wave soldering wave peak welding machines, reflow soldering machine. 无铅波峰焊,波波峰焊,峰焊接机,回流焊接机。
- After reflow soldering and restored at room temperature, they meet the characteristics listed below. 經過回流焊並冷卻至室溫後，電容器的特性符合下表的要求。
- In the course of the lead free reflow soldering,lead and Lead free of reflow soldering affect the quality of product. 在再流焊无铅化过程中,再流焊的有铅要素与无铅要素的兼容性直接影响产品质量。
- Development of advanced electronic package devices promoted the study on the reflow soldering. 先进电子封装器件的出现推动了再流焊方法和设备的研究。
- Solder paste is essential material in SMT, which is widely used in reflow soldering. 焊膏是SMT工艺中不可缺少的钎焊材料,广泛应用于再流焊中;
- It is compatible with automatic placement equipment and is designed for either reflow soldering or a lead (Pb)-free solder process. 该器件可与自动贴装设备兼容,并且面向再流焊接或无铅(Pb)焊接工艺而设计。
- Reflow Soldering: Melting, joining and solidification of two coated metal layers by application of heat to the surface and predeposited solder paste. 回流焊:应用加热金属涂敷层的表面和预涂焊膏,熔融,连接和凝固两个金属涂层。
- Delamination caused by electrical-over-stress (EOS) and moisture expansion during reflow soldering have shown different delamination patterns. 由过电应力(EOS)和再流焊中的水汽膨胀引起的分层会显示出不同的失效模式。
- Tombstone phenomenon results from unbalance of solder surface tension on two pads of component soldering terminal during reflow soldering. “竖碑”现象是元件两端焊盘上的焊膏在回流熔化时对元件两个焊接端的表面张力不平衡所致。
- This article expounds the future development of reflow soldering technology according to the changes of technology in SMT. 主要针对SMT技术发生的巨大变化,对再流焊技术未来发展进行了简单的阐述。
- An automated optical inspection (AOI) machine can be put anywhere on the line to catch defects, and systems that continuously monitor the thermal profile in solder reflow ovens are becoming popular. 自动光学检测（AOI）机可安装在生产线的任意位置，以便捕捉缺陷，而能够连续监控再流焊炉的热曲线的设备也越来越流行。
- Once identified, the SMDs can be properly packaged, stored and handled to avoid subsequent thermal and mechanical damage during the assembly solder reflow attachment and/or repair operation. 一旦被确认，SMD可被适当的包装、贮存和处理已避免在组装过程中的回流和/或返修中的热和机械损伤。
