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- However, the solder joint reliability under thermal cycling conditions becomes a critical problem when mounting the WLP onto a PCB when the underfill layer has been eliminated. 然由于晶圆级构装不填注底胶，因此当晶圆级构装于组装PCB基板后承受热循环负载时，焊锡接点可靠度已成为构装结构主要可靠度问题之一。
- Research on Lead-Free Solder Joint Reliability 无铅焊点的可靠性研究
- Keywords BGA;void;mechanism;solder joint reliability; 球栅阵列;气孔;机理;焊点可靠性;
- Effects of thermal cycle parameters and substrate dimensions on solder joint reliability 热循环参数及基板尺寸对焊点可靠性的影响
- Effects of Stand-off Height between Chip Component and Substrate on Lead-free Solder Joint Reliability 片式元件与基板间隙对无铅焊点可靠性的影响
- Solder Joint Reliability of Plastic Ball Grid Array Component Based on Design of Full Factorial Experiment 基于全面析因试验的塑封球栅阵列器件焊点可靠性
- Keywords microelectronic interconnection;solder joint shape;solder joint reliability;thermal fatigue life; 微电子互连;焊点形态;焊点可靠性;热疲劳寿命;
- Keywords Solder joint reliability, flip-chip on board, underfill, delamination,,,,,crack; 焊点可靠性;基板倒装焊;底充胶;分层;裂纹;
- Keywords: flip-chip technology；solder joint reliability；FEM；solder joint height；underfill materials； strain；stress 关键词：倒装焊技术；焊点可靠性；有限元法；焊点高度；下填料；应变；应力
- Automatic Management System of Solder Joint Reliability in Reflow Soldering 再流焊焊点可靠性自动管理系统
- Therefore, it is necessary to study the reliability of this mixed solder joint. 因此，有必要对这种混合焊点进行可靠性分析。
- Therefore,it is necessary to study the reliability of this mixed solder joint. 因此,有必要对形成的混合焊点进行可靠性分析。
- solder joint reliability 焊点可靠性
- Research Progress of Lead-free Solders and Solder Joint Reliability in Electronic Packaging 无铅电子封装材料及其焊点可靠性研究进展
- The quality of solder joint affects the reliability and lifetime of the products produced by SMT directly. 摘要由表面组装技术(SMT)形成的产品，其焊点质量直接影响到产品的可靠性和寿命。
- The quality of solder joint affects the reliability of the products produced by SMT directly. 由表面组装技术(SMT)形成的产品,其焊点质量直接影响到产品的可靠性。
- Analyse the failure modes and mechanism of the mixed solder joint,and introduce the effect factors of reliability ulteriorly. 对混合焊点的失效形式和混合焊点的失效机理进行了分析,并进一步介绍了影响这类焊点可靠性的因素。
- The solder joint exceeds the strength of Type L tube in annealed temper. 这种焊料连接超过退火处理类型L管道的强度。
- The resulting solder joints have demonstrated improvements in grain structure and have shown a marked increase in reliability. 得到的焊点的晶粒结构得以改善,焊点的可靠性得到了显著提高。
- The analysis results show that process is the most important effect factor for the prophase reliability of mixed solder joint, and environment is the most important effect factor for the anaphase reliability of mixed solder joint. 分析结果显示，工艺对混合焊点的前期可靠性影响最大，环境对混合焊点的后期可靠性影响最大。
