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- During subsequent reflow the solder pulls back onto the wettable pad surface to form a solid solder bump structure. 在下一个回流工序，锡膏浸润焊盘表面，形成一个固态锡膏凸起。
- The manufacture of solder bump is one of the key technologies for area array packaging (AAP) such as ball grid array (BGA), chip scale packaging (CSP) and flip chip (FC). 钎料凸台的制造是球栅阵列封装(BGA, ball grid array)、芯片尺寸级封装(CSP, chip scale packaging)及倒装芯片封装(FC, flip chip)等面阵封装的关键技术之一。
- Y. Kato, Y. Ueoka, E. Kono, E. Hagimoto, Solder bump forming using micro punching Technology, Electronic Manufacturing Technology Symposium 4-6 (1995) 117-120. 陈嘉舜、郭佳儱，电极材料对于圆盘放电特性影响之研究，第十八届机械工程研讨会论文，第四册制造与材料(下)(2001)571-578.
- With the trend toward miniaturization, solder bumps are getting smaller, and the electric current loading of each solder bump is getting higher. 随著电子产品之微小化，焊料凸块的尺寸越来越小，而焊料凸块的电流密度也随之增大。
- As an electric current passes through, the Joule heating and electromigration effects occur in the flip chip solder bumps. 当电流通过焊点时，会伴随产生焦耳热效应和电迁移效应。
- Solder Bumps: Round solder balls bonded to the pads of components used in face-down bonding techniques. 焊锡突点:在晶面向下的黏结技术中用于黏接元件焊盘的圆形焊料球。
- And techniques to make lead-free solder bumping with electroplating are illustrated. 重点阐述了采用电镀制作无铅焊料凸点的方法。
- Preparation of SnPb solder bump by electroplating process 电镀方法制备锡铅焊料凸点
- Keywords solder bump;submodel;fatigue life prediction; 焊球;子模型;寿命预测;
- Glenn A. Rinne, “Issues in accelerated electromigration of solder bumps”, Microelectronics Reliability, 43, pp1975-1980, 2003. 吴文发,秦玉龙,“电迁移效应对铜导线可靠度之影响”,奈米通讯,第六卷第一期。
- Thus, the thesis is aimed to investigate the effects of electromigration behavior on flip-chip package eutectic Sn-Pb solder bumps reliability under high current density. 本论文的研究目的主要在探讨覆晶封装共晶锡铅焊锡凸块在高电流密度作用下电子迁移效应对其可靠度的影响。
- She tripped and went down with a bump. 她绊了一下，猛地跌倒在地上。
- It is also found that the geometry of a flip-chip joint and void formation have stronger effects upon current crowding than the multi-phase nature of solder bumps does. 在本研究亦发现，覆晶接点的几何形状和孔洞对于电流聚集有很大的影响，其效应远胜于焊料中的多相结构。
- The two children collided with a bump. 两个孩子砰的一声撞上了。
- I really am so sorry to bump into you. 撞着你了真是非常抱歉。
- That bad failure brought them down to earth with a bump. 那次惨重的失败才使他们猛然知道天高地厚。
- Mind you don't bump your head on the low ceiling. 天花板很低，留神别碰头。
- She tripped over a bump on the road. 她被路上一块隆起的地面绊了一下。
- A bump on the head caused her amnesia. 她因头部撞了一下而得了健忘症。
- No man feel like laughing when he bump his funny bone. 没有人在撞伤了笑筋时想要笑。
