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- solder ball pull 焊球抗拉
- At the same time,experiments on PBGA solder ball laser reflow were carried out. 同时，本文还对PBGA钎料球激光重熔进行了试验研究。
- Slumping problem can be prevented during pre-heat. Solder short and capillary solder ball can be kept away. 预热阶段,不会产生塌陷,可大幅改善桥连,微细锡珠等问题。
- After the except ion of the solder ball with failure mode A1, the major failure mode in drop test was mode B3. 扣除掉破坏模式A1的锡球后，掉落冲击实验中锡球以破坏模式B3居多；
- This thesis is devoted to the orientation and the detection of the HDD slider when bonded in SBB (solder ball bonding) machine. 本文主要研究SBB(solder ball bonding)机器中硬盘磁头焊接时的定位和检测。
- EPBGA model consists of seven parts, they are heat spreader, molding compound, chip, substrate, thermal vias, solder ball and PCB board. EPBGA构装体由七个部分所组成，分别为散热板、成形树脂、晶片、基板、热通孔、锡球及印刷电路板。
- The analytical results established that a suitable size of Cu stud in a solder ball could effectively enhance the ball's shear strength. 研究结果指出锡球包含适当尺寸之铜凸块可有效提升锡球剪力强度。
- So it will result in rigidity skin &block and solder balls etc. 产生的后果是：锡膏出现硬皮、硬块、难熔并产生大量锡球等。
- Abstract: Fabricating methods often used for solder ball in the BGA package were reviewed.UDS （uniform droplet spray）, which is widely investigated was analyzed. 摘 要: 综合介绍了BGA封装使用锡球常用制造方法，分析了研究较多的均匀颗粒成型技术的原理。
- In this paper we report the analysis of underfill encapsulation between the solder ball, micro-chip and substrate by experiment and 3D mold flow simulation. 文中主要探讨了覆晶封装底胶充填时,锡球、芯片及基板间的流动状况。
- Solder Bumps: Round solder balls bonded to the pads of components used in face-down bonding techniques. 焊锡突点:在晶面向下的黏结技术中用于黏接元件焊盘的圆形焊料球。
- Defects such as bridging, non-wetting, de-wetting and the potential for solder balls can increase. 诸如桥接、不熔湿、反熔湿以及发生焊料结球等缺陷的的可能性可能增加。
- If we can pull through this recession, we will be in good shape. 如果我们能渡过这段经济不景气的时间，我们就会好多了。
- Joe tried to pull the heavy cart, but to no avail. 乔想拉那部笨重的大车，但是拉不动。
- Internally, the device is Pb-free, except for flip-chip high-temperature Pb-based solder balls, currently exempt from RoHS. 在内部,除倒装法使用的当前豁免于RoHS的高温含铅焊球外,该器件不含铅。
- The Kester 979 Liquid Flux contains a unique blend of activators that promote excellent wetting without solder balls adhering to the solder mask. 凯斯特979液体焊剂含有一种独有的混合活化剂,可以促进熔湿作用而不使锡球粘附在阻焊模上。
- The newspaper owner failed to pull the paper round. 报馆老板没能挽救该报的失败。
- Pull up these plants by the roots. 将这些植物连根拔起。
- This could cause a variety of solder defects, ranging from solder balling to non-wetting to damaged devices to voiding to charred residues. 这样会产生许多焊接缺陷，诸如锡球、润湿不良、破坏元器件、空洞、碳化等。
