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- Hot plate with silicon wafer lowered to heating position. 加热板与矽晶圆降低至加热位置。
- Mechanical Test Wafer - A silicon wafer used for testing purposes. 机械测试晶圆片-用于测试的晶圆片。
- Contamination Particulate - Particles found on the surface of a silicon wafer. 沾污颗粒-晶圆片表面上的颗粒。
- Hot plate with silicon wafer in initial configuration (before heating). 加热板与矽晶圆在启始状态(加热前)。
- SiO2, an insulator, can be formed by oxidation of surface of the silicon wafer. 经净化的晶棒接著用机械方法切成薄片.;这些切片就叫做晶圆
- A New Method of Resistless Photochemical Etching for Silicon Wafer[J]. 引用该论文 杨杰;刘焰发;村原正隆.
- The processing characteristics and some material properties of silicon wafers depend on the orientation. 硅片的工艺性质与某些材料特性均与晶向有关。
- Silicon wafers are zapped with ions, which form tiny islands with either an excess or a dearth of electrons. 矽晶圆用离子轰击，而在其上形成微小的岛，各自具有过量或是不足的电子。
- Contamination Area - An area that contains particles that can negatively affect the characteristics of a silicon wafer. 沾污区域-部分晶圆片区域被颗粒沾污,造成不利特性影响。
- Micro-machined static mixers only 22mm2, etched from silicon wafers, can be used for small chemical sensors. 微型加工的静态混合器只有22mm2大，由硅片刻蚀而来，可用于小型化学传感器。
- Dopants for silicon wafers are found in Groups III and V of the Periodic Table of the Elements. 晶圆片搀杂剂可以在元素周期表的III和V族元素中发现。
- The morphology evolution of single crystal silicon wafers in the hydrothermal process was investigated. 详细研究了铁钝化多孔矽水热制备过程中单晶矽片表面的形貌演化。
- Most conventional solar cells are made up of silicon wafers, a brittle substance that limits where they can be placed. 太阳能电池，能量转换成电能的太阳，是在不断增长的需求由于石油价格不稳定和关注全球变暖。
- The hippocampal cells show tight adherence on silicon wafers with nano-scale surface topograph. 其中重要的基础研究问题就是理解和控制神经元与材料的界面反应。
- LDK makes silicon wafers, a key ingredient in solar cells, which in turn are used in solar panels. LDK生产晶圆，这是太阳能电池的主要材料。而太阳能电池则用于太阳能板中。
- Metal contamination in Czochralski (CZ) silicon wafers is one of the important issues in device fabrication processes. 在集成电路工艺过程中，金属玷污会对器件的性能有着致命的影响。
- ICs, is the process of transferring geometic shapes on a mask to the surface of a silicon wafer. 光刻技术应用到集成电路制造中，就是将掩模版的几何图形转移到硅片表面的工艺过程。
- In this process, a standard stencil printing technique is used to print solder paste directly onto silicon wafers( Figure4). 在这个过程，标准印刷技术用来把锡膏直接印刷到硅晶片上。
- Chip: The individual circuit or component of a silicon wafer, the leadless form of an electronic component. 芯片:单回路或元件的硅晶元,无引脚的电子元件。
- Test Wafer - A silicon wafer that is used in manufacturing for monitoring and testing purposes. 测试晶圆片-用于生产中监测和测试的晶圆片。
