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- reflow rotio 回流比
- Do not inhale the vapor during reflow. 不要吸入回流焊时喷出的蒸气。
- Adapted to the reflow soldering. 适应于回流焊接。
- Suit for reflow and wave flow solder. 适应再流焊与波峰焊。
- Suitable reflow and wave soldering. 适合于回流焊和波峰焊
- Clear how to measuring reflow and wave profile. 清楚怎样测量回流焊和波峰焊温度曲线。
- Reflow solder paste in 2 hours as soon as possible after printing. 印刷后要在2小时内回流焊膏。
- Should a nitrogen atmosphere be used in the reflow process? 回流工艺中是否应使用氮气?
- Your next BEST choice in Lead Free capable reflow oven. 您的下一个最佳的无铅回流焊炉的选择一定是保乐。
- Compatible with infrared and vapor phase reflow solder process. 适用于回流焊接工艺。
- The most obvious is the necessity for increased reflow temperature. 最明显的是，使用无铅锡膏必须提高回流焊温度。
- The reflow process relies on the temperature profile setting. 回流过程依赖于温度曲线的设定。
- What happens to no-clean flux residues at the higher reflow temperatures? 较高的回流温度会对免清洗焊剂的残留物造成怎样的影响?
- The reasons of reflow discoloration of tin deposit on connector were analyzed. 分析了连接器锡镀层发生回流变色的原因。
- In SMT reflow soldering process,profiling a PCBA is a extremely important step. 在SMT回流焊的整个流程中，为组装电路板设定合适的温度分布曲线是十分重要的一个环节。
- At the same time,experiments on PBGA solder ball laser reflow were carried out. 同时，本文还对PBGA钎料球激光重熔进行了试验研究。
- Peak soldering reflow temperature also impacts cleaning performance. 再流焊的峰值温度也会对清洗性能造成影响。
- Through-hole reflow is a new concept of the contemporary assembly technolog y. 介绍了通孔回流焊的概念、特点、分类和使用工艺要点。
- Are outputted boards at least sample inspected pre reflow for placement, missing components, and solder defects? 回流焊输出之板是否至少抽样检查板的置件精度,有无少件和不良焊点?
- A summary of developmental work done in the field of single pass high reliability Flip Chip Reflow Encapsulants. 关于单遍高可靠性倒装片回流密封剂领域研发工作成就的综述。
