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- power device packaging 功率器件封装
- Low voltage rating power device. 低电压启动。
- As for high power device, paste/SSDA is used popular for die attach. 对那些做大功率器件的客户来说，锡膏或者焊线用来贴芯片比较普遍。
- At every step of production, from crystal growth to device packaging, numerous refinements are being made to improve the yield and reliability. 在生产中，为提高其成品率和可靠性，从晶体生长到器件封装每一步工序均有很多细致工作要做。
- A powerful device exploded outside the station. 一枚威力巨大的炸弹在车站外爆炸了。
- The microPower is the smallest and most discreet hearing aid in the world's power device in the industry. 小霸王是世界助听器行业中体积最小、最精致的大功率助听器。
- This paper also cited some common medical device package systems. 本文最后还列举了常见的医疗器械包装系统。
- Broadband high power devices become main research object. 宽频带高功率器件成为主要的研究对象。
- Broadband high power devices are main research object. 宽频带高功率器件成为主要研究对象。
- Valve actuation utilizes a mechanical power device, an actuator, to operate a valve. 阀门执行机构是一种采用机械力的设备，一台执行机构操作一个阀门。
- To obtain high performance and low power device, gate oxide thickness shrinkage is a main stream in modern ULSI industry. 摘要:为了达到高性能和低电压之元件，减少闸极氧化层厚度是现代超大型积体电路工业的一个主流。
- He needed to devise a powerful device to detain this devil next time! 他要设计一个强有力的装置下次把魔鬼扣留起来!
- Discrete Device Packaging and Its Typical Types 分立器件封装及其主流类型
- The structure of the high-voltage power device was verified and simulated by MEDICI,and the withstand voltage exceeds 600V. 运用MEDICI器件结构仿真工具对高压器件的结构进行了模拟仿真,达到了600V以上的耐压要求。
- Single-used Medical Device Packaging 一次性医疗器械包装
- Kinney offers further advice to those going on vacation: Unplug power devices. “月”是和“太阳”相反的存在，相对于太阳的“阳”，“月”代表了“阴”。
- Low power consumption longevity for battery powered devices. 低电能的消耗。
- Abstract: Burn-out of a microwave power device due to the poor bonding between beryllium oxide and base metal sink was investigated using Sound Seanning technique. 摘要：利用声学扫描检测技术，揭示了热烧毁的微波功率器件氧化铍陶瓷基片与底座金属散热片的焊接不良现象；
- This new material provides a main ehannal to solve the heat matching of electronic device package. 它的出现为解决电子元器件的封装热匹配问题提供了一条有效途径。
- This new material provides a main channal to solve the heat matching of electronic device package. 它的出现为解决电子元器件的封装热匹配问题提供了一条有效途径。
