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- Coat the surface with either nickel or copper (nickel is now generally the preferred commercial process) from an electroless plating solution. 用镍或者铜在无镀电镀液中进行表面处理，目前镍是更流行的商业用工艺。
- In order to obtain stable brush plating solution and good galvanization performance,various ligands are added. 在刷镀溶液中要加入各种配体,以得到稳定的电镀溶液和较好的电镀效果。
- The ways to prevent iron brush plating solution from being oxidized during storage and working are described. 阐述电刷镀铁液贮存期间和刷镀过程中防氧化的方法。
- Method used to remove sodium sulfate and sodium phosphite in the plating solution was given. 随着施镀的进行,化学镀镍液中的硫酸钠和亚磷酸钠的积累越来越多,从而影响镀液的使用寿命。
- Specific monoamine may be added as accelerator into electroless copper plating solution to perform high speed deposition. 在化学镀铜液中添加有特效的一元胺作加速剂可以获得特别快的沉积速度.
- The experimental results show that the nickel electroless plating solution was stable and the nickel coating obtained with the solutio... 这说明玻璃表面用镍活化以取代用钯活化是一种可行的方法。
- It seems that acidic tin plating solution is being trans formed from fluoborate based to alkyl sulfonate based solution. 说明酸性镀锡液由氟硼酸盐型发展为烷基磺酸盐型的改进过程。列出参考文献9篇。
- In gravure, a material added in small quantities to plating solution for the purpose of modifying the character of a deposit. 中义在凹版印刷中，为改变版面堆积特性所加入制版溶液中的少量物质。
- The mechanisms on increasing matel deposition rates and plating solution stability,improving the properties of crrosionproof,wearproof ... 对今后稀土在化学镀中的应用研究和发展提出了建议并进行了展望。
- The nanocomposite coating is obtained by electrochemical deposition of the zinc plating solution with ceria nanoparticles (mean diameter 30 nm). 将纳米氧化铈颗粒加入镀锌液中进行复合电沉积制得纳米复合涂层。
- Determination of molybdenum in both Ni-Mo alloy deposit and plating solution using DTPA as chelating agent was described with high accurate results. 介绍了以DTPA为螯合剂，采用螯合滴定法测定镍钼合金镀层和镀液中的钼含量。结果表明，该方法准确度高，具有实用价值。
- The component data of pearl nickel, bright nickel , acidic copper and brass plating solution in production were analyzed when the best result of the plating deposit obtained . 为了获得电镀的最佳结果,在生产中对珍珠镍、光亮镍、酸性铜和黄铜四种镀液的成分参数进行了统计分析。
- The main treatment methods of spent electroless nickel plating solution include chemical deposition, catalytic reduction, electrolysis, ionic exchange, etc. 化学镀镍废液的处理方法主要有化学沉淀法、催化还原法、电解法、离子交换法等。
- It was found that CTAB can disperse the nano-MoS2 particles in plating solution well. The optimal addition volume of nano-MoS2 was 2.0g/L, and the content of nano-MoS2 in composite coating was affected by original surface roughness of sample. 发现十六烷基三甲基溴化铵(CTAB)可以很好地在镀液中分散纳米MoS2;镀液中纳米MoS2颗粒的添加数量最佳值是2.;0g/L;试样表面粗糙度影响复合镀层中纳米MoS2含量。
- With the raise of pH value of electroless nickel plating solution, content of phosphorus in deposit was lowered, and moreover, Ni(OH)_2 was probably precipitated and mingled with Ni-P deposit which resulted in ascension of resistance. 化学镀镍溶液pH值升高,镀层磷含量降低,同时可能生成Ni(OH)2沉淀夹杂在镀层中,从而使电阻升高;
- An acidic Zn-P alloy plating solution is recommended,in which tartaric acid,dextrin and boric acid are used as grain refining agents,and salicylaldehyde and glycine act as brighteners to obtain fine and bright deposits. 在推荐的酸性镍磷合金镀液中,用酒石酸、糊精、硼酸作镀层晶粒细化剂,水杨醛、甘氨酸作光亮剂,能获得细致、光亮的镀层。
- A technological investigation of acidic copperplating with high polish, high dispersibility of plating solution and high bond strength between film and substrate has been performed. 研究了一种具有高结合强度、又具有高分散性的光亮酸性镀铜工艺。
- Table liste d cathodic current density and average load in different plating solutions, ther eby tank size was calculated. 列表说明各镀种阴极电流密度、平均装载量等数据,由此计算所需设置的镀槽尺寸。
- It is shown that,the technology has good deep plating ability and homogeneous plat ing ability,a new mode of controlling Zn and Fe ion in plating solution put ou t by Germany KUNZ Company. 德国科兹公司提出镀液中锌、铁离子控制的新型模式。
- Calculation of tank dimension was given by practice. Table liste d cathodic current density and average load in different plating solutions, ther eby tank size was calculated. 根据实践经验总结出一种合理的电镀槽尺寸核算选配方法。列表说明各镀种阴极电流密度、平均装载量等数据,由此计算所需设置的镀槽尺寸。
