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- Plated through hole structure test 镀覆孔的结构检验
- Reliability of plated through hole (PTH) has close relationship with technology parameters during manufacture process. 摘要镀通孔的可靠性与制造过程工艺参数有非常密切的关系。
- Keywords： printed circuit board, plated through hole, copper clad laminate, epoxy. 关键词：印刷电路板，贯孔，铜箔基板，环氧树脂
- Failure mechanism and physics model of plated through hole in manufacture process 镀通孔制造过程中的失效机理与物理模型
- Discuss About the Process Quality Control Technology of Plated Through Hole of the Multilayer Printed Circuit Board 多层印制板孔金属化过程品质控制技术探讨
- plated through hole process 贯通孔电镀工艺
- Air hole structure incorporating our airy effect. 泡棉透气结构具有通爽作用。
- plated through holen. 镀通孔
- The analysis of the plating defect of plated through hole of the multilayer printed circuit board and countermeasure 多层印制板金属化孔镀层缺陷成因分析及相应对策
- Keywords non-formaldehyde;PTH （plating through hole）;darkness;copper oxide; 非甲醛;化学镀铜;发黑;氧化铜;
- Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PCBs 印制板中小直径镀覆孔可靠性评价联合试验
- The through hole PCPL (TH-PCPL) structure is proposed to be a low cost realization of the PCPL structure in four layer PCB. 利用高介电连通柱束光子晶体结构可得到许多不同等效介电常数的等效高介电材质，利用这些等效材质在设计截止频带时能作更多变化，更有弹性。
- Run ribbon through holes and fasten it off at the wrist with a neat bow. 将丝带穿过那个孔在手腕处打一个蝴蝶结。
- plated through holes (PTH) 镀通孔
- The paper described the applying condition of pressure detection in realizing proximate balance drilling,predicting abnormal pressure and designing hole structure. 该文阐述了压力检测在实现近平衡钻井、进行异常压力预报与井身结构设计过程中的应用情况。
- Propeller fans exhaust air through holes in the wall. 螺旋式通风机从壁孔中排出空气。
- The surface, crystalline structure, hole structure and aperture distribution of the microspheres synthesized were characterized by various methods, such as TEM, SEM, UV-VIS, XRD TG-DTA ,BET and nitrogen-adsorption etc. 对所合成的微球用TEM，IR，XRD，UV-Vis，TG-DTA和BET等表征手段进行了表面形貌、晶形结构、孔结构及孔径分布等性质的研究。 结果显示，微球是由十几个纳米的TiO_2晶粒堆积成的多孔微球，微球具有较高的降解活性。
- An efficient method to calculate the quasi-static capacitance of the via hole structure embedded in a multilayered dielectric media named Dimension Reduction Technique(DRT) is presented. 本文采用维数缩减技术(DRT)提取了多层介质中通孔结构的准静态电容参数。
- Could you tell me the price different between micro via PCB and through hole via PCB? 你能告诉我微过孔电路板与穿透式过孔电路板价钱的差别吗?
- Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors. 通孔盘状及平面阵列陶瓷多层电容器焊料所含的铅;
