您要查找的是不是:
- plastic package lead frame 塑料封装引线柜架
- Xinzhong Plastic Package Machine CO., LTD. 鑫众塑料包装机械有限公司。
- Plastic package with Water Clear. 无色透明封装。
- The lead frame with the opening in die pad can significantly improve the package warpage and die stresses. 导线架晶片座开槽型式,对构装翘曲及晶片应力也有明显改善效果。
- At the same time production of IC lead frame, fluorescent display, VFD display, grid and plastic processing business. 同时生产集成电路引线框架、荧光显示屏、VFD陈列、栅网及塑料加工业务。
- Guangzhou Xinghong Plastic Package Products Co., Ltd. 广州新鸿塑料包装制品有限公司。
- Any chamber size are available for customer's Lead frame or strip. 可以制作特殊规格的工作室尺寸。
- Result: IR can identify the material characteristic of plastic package. 结果:不同材料药用塑料瓶的红外光谱具有特征性。
- It is suitable for the plastic package of licks,toys and make-up products,etc. 产品说明:最适合锁具、玩具、化妆品之吸塑包装用。
- The low-profile TLMx100x LED package consists of a reliable lead frame base embedded in a clear epoxy. 超薄TLMx100x封装包含嵌入在清晰环氧树脂中的可靠引线框基盘。
- C194 copper alloy is one of the representative materials of lead frame. C194铜合金是最具代表性的引线框架材料之一。
- Method: Measure and analysis IR spectra of plastic package using several samplings. 方法:采用了不同制样方式分析测定常用药用塑料瓶的红外光谱。
- Vacuumized plastic package, keeping freshness in a unique way, is indeed super and reliaBle. 真空塑料包装,保鲜独到可靠。
- Fido gets a plate for his doggie stew, but Phyllis eats straight out of the plastic package or bag. 小狗菲多吃装在盘子里的狗食炖肉,但它的主人费利斯却直接从塑料袋里拿东西吃。
- Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production. 全自动粘片机是将半导体晶圆微芯片贴装到引线基架的半导体后工序关键性生产设备。
- Method:Measure and analysis IR spectra of plastic package using several samplings. 方法:采用了不同制样方式分析测定常用药用塑料瓶的红外光谱。
- Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production. 粘片机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备。
- Hernandez R J, et al, Plastic Packaging[M]. HANSER, 2000 . 苏远.;塑料薄膜透气性能的测试[J]
- Semiconductor manufacturing:reel-to-reel plating, pin plating, lead frame plating, deflashing, Spot plating and electro polishing etc. 半导体元器件电镀:卷对卷电镀,接触器件电镀,引线框架电镀,电抛光,选择性点镀等
- The sensing element and the measuring ASIC are assembled in a dual-in-line (DIL) plastic package with pins for surface mount and re-flow soldering. 加速度计的敏感元及测量专用芯片 (ASIC) 集成在 DIL 塑料封装内,其引脚可用于表面安装和回流焊接。