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- Xylene resin modified phenolic molding compound 二甲苯树脂改性酚醛压塑粉
- aniline modified phenolic molding compound 苯胺改性酚醛模塑料
- nylon modified phenolic molding compound 尼龙改性酚醛压塑粉
- NBR Modified phenolic molding compound 丁腈橡胶改性酚醛压塑粉
- According to the technological requirements of post-curing of phenolic molding compounds for automobile starter commutator,it is proposed to realize the specific programs of the control system. 根据汽车起动机换向器酚醛模塑料后固化工艺要求,提出控制系统的具体实现方案。
- Preparation of Organic-fiber Reinforced Heat Resistant Phenolic Molding Compound 有机纤维增强的耐热型酚醛模塑料的研制
- phenolic molding compound 酚醛模压混合剂
- The product is a thermosetting molding compound, it is based on phenolic resin as a matrix and mixed with inorganic glass fiber, mineral filler and other additives. 本产品以酚醛树脂为基材,加入玻璃纤维和矿物填料及其它助剂所制成的热固性模塑料。
- The product is a thermosetting molding compound, it is based on phenolic resin as a matrix and mixed with organic fiber and mineral filler and other additives. 本产品是以酚醛树脂为基材,加入有机纤维和矿物填料及其它助剂所制成的热固性模塑料。
- phenolic molding compounds 酚醛模塑料
- Bulk Molding Compound is specifically formulated for injection molding of automotive headlamp reflector applications. 玻璃纤维增强团状模塑料,是为汽车车灯设计的特殊配方。
- Bulk Molding Compound with medium strength material with excellent moldability and moderate strength.Used in multi-purpose applications. 玻璃纤维增强团状模塑料,中等强度和优异电性能,低成本,良好的成型性。广泛应用于各种领域。
- EPBGA model consists of seven parts, they are heat spreader, molding compound, chip, substrate, thermal vias, solder ball and PCB board. EPBGA构装体由七个部分所组成,分别为散热板、成形树脂、晶片、基板、热通孔、锡球及印刷电路板。
- Compared with SMC, LPMC is an excellent kind of the sheet molding compound in respect of moulding pressure and equipment etc. 同片状模塑料比较表明,低压模塑料在成型压力、设备等方面具有明显的优势,不失为优秀的片状模塑料品种。
- Bulk Molding Compound with high strength material with excellent moldability and moderate strength.Used in multi-purpose applications. 玻璃纤维增强团状模塑料,高等强度和优异电性能,低成本,良好的成型性。广泛应用于各种领域。
- Tension and fatigue tests on a widely used packaging epoxy molding compound (EMC) were performed under room and high temperatures. 对在微电子封装中应用很广的环氧模塑封装材料进行了常温和高温下的拉伸、疲劳实验。
- Thermoset composites are available in Bulk Molding Compound (BMC) or Sheet Molding Compound (SMC), depending on the application. 根据不同的应用领域,我们提供团状模塑料 (BMC)或片状模塑料 (SMC)热固性复合材料。
- This thesis considers the delamination behaviors between substrate and molding compound for Ball Grid Array (BGA) products caused by the plasma etching process. 中文摘要本文针对阵列锡球封装产品基板和胶饼间所产生的分层作研究。
- This thesis researches to address the occurrence of delamination phenomenon between the interface of molding compound and the copper leadframe die paddle during assembly process. 中文摘要本论文主要针对铜钉架在经过封装制程其本身与胶饼间所产生的脱层现象做研究。
- phenolic resin molding compounds 酚醛树脂模制材料