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- package thermal stress 封装热应力
- The reliability of BGA package is dramatically improved by decreasing the peak thermal stress. 在封装体中，锡球的几何形状，或是其材料性质，多少会对锡球接点的应力结果有所影响；
- Bottom-side heating is important in soak and reflow phases for successful installation while exposing the PCB and package to a minimal amount of thermal stress. 在热渗透和再流阶段，采用底面加热对成功的组装非常重要，这种加热方式可使PCB和封装器件暴露在最小的热应力环境中。
- What kinds of thermal stress are there in the reactor? 在反应堆里有哪一种热应力?
- Conduct material Fatigue Testing and Thermal stress test. 进行材料疲劳测试和热应力测试。
- The temperature and thermal stress distributions in the front end photo shutter of Shanghai Synchrotron Radiation Facility (SSRF) were simulated carefully by the finite element package ANSYS. 利用有限元分析软件ANSYS，对上海同步辐射装置(SSRF)前端光子档光器，进行了精细的温度和热应力分析。
- Study on Modeling of Rotor Thermal Stress with Varying Coefficients. 汽轮机转子热应力自适应模型研究。
- Thermal Stresses Due to Temperature Transients. 温度转变引起的热压力。
- The thermal stress can be mitigated effectively when P is 1 and n is 6. 随着梯度层数的增加， 热工作热应力的最大值逐渐减小， 但当梯度层数达到6时， 随着梯度层数的增加， 缓和效果并不明显；
- These withstand heavy loads and thermal stresses well. 它们能很好地耐受重负荷和热应力。
- Both transient and steady-state thermal stress can be determined by this procedure. 瞬态和稳态的热应力均可用这种方法测定。
- The progress of thermal stress analysis of the FGM is reviwed and the development trends in this area are prospected in this paper. 回顾了近年来梯度功能材料（FGM）热应力研究领域所取得的研究成果，并对FGM热应力研究的发展趋势作一展望。
- In this paper,the progress of thermal stress analysis of the FGM is reviewed and the development trends in this area are prospected. 回顾了近年来梯度功能材料(FGM)热应力研究领域所取得的研完成果,并展望了FGM热应力研究的发展趋势。
- Beeaase it can remit thermal stress, FGM is ideal thermal resistant and heat isolating material for future spacecraft. 这种材料由于能够缓和热应力,是未来航天飞机器用的理想耐热、隔热材料。
- Thermal stress is bigger at bottom and on the top of building, and thermal stress is less in the middle of building. 温度应力总是在建筑物底层和顶部几层的应力较大,而建筑中部楼层的温度应力较小。
- Thermal stress of frame structures whose plane is arc was analysized and compared with that whose plane is ring. 对弧形框架在均匀温差作用下的温度应力进行了计算分析,并与圆环框架结构进行对比,总结其温度应力特点。
- As CTE mismatch of materials,it is possible that chips crack in thermal stress lumped rigion. 并且由于环氧模塑封材料、芯片之间的热膨胀系数失配,芯片热应力集中区域有发生脱层开裂的可能性。
- The gay package is only for dandy. 这种鲜艳的包装只是为了美观。
- The goods are to be sent in airtight package. 这批货物应密封包装运送。
- Then,the temperature field is loaded in FEA software to predict thermal stress and deformation. 并以此温度场为边界条件,利用FEA软件计算了机体热应力和热变形。
