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- The result show that the HEDP-Cu plating bath has same separate and covering power as cyanide copper plating bath,the current efficiency is much batter(is up to 90%),while... 实验表明在此工艺条件下,镀液的分散能力与覆盖能力与氰化镀铜相当,电流效率比氰化镀铜高得多,可达90%25以上,镀层结合力良好,基本无脆性,具有代替氰化物镀铜的良好前景。
- One trouble shooting case in cyanide copper plating 氰化镀铜故障处理一例
- Study of bright cyanide copper plating 氰化物光亮镀铜工艺的研究
- Determination of Total Cyanide in Cyanide Copper Plating Bath 氰化镀铜液中总氰化物的测定
- Study on the New Process of No Cyanide Copper Plating 无氰电镀铜新工艺试验研究
- this paper summarize process of Non-cyanide Alkaline Brightness Copper Plating for to substituted cyanide copper. 本文概述了取代氰化镀铜的无氰碱性光亮镀铜工艺及其在生产中的应用情况。
- non- cyanide copper plating 无氰镀铜
- Zinc base die castings are always copper plated in cyanide baths. 锌基合金的压铸件总是在氰化镀液中镀铜。
- Zinc base die castings are always copper plated in cyanide baths . 锌基合金的压铸件总是在氰化镀液中镀铜。
- A cyanide tin - copper plating process was optimized by means of orthogonal test.The effect of bath components of electrolytic solutions and electrodeposits was investigated. 采用正交试验研究了氰化镀铜锡合金工艺中各因素水平与镀液、镀层性能的关系，优选出一种最佳工艺配方。
- In order to solve the problems such as high copper plating cost,vulnerable oxidation of plate film,non sinter and over sinter which take place in bimetal bush production,a sinter surface technology without copper plate has been studied in this paper. 针对双金属衬套产品生产过程中存在的镀铜成本高、镀层易氧化、烧结易产生漏烧、过烧等实际问题,研制开发了钢板无镀烧结表面处理工艺。
- The good dispersivity colloids have excellent catalysis for direct copper plating and its UV-VIS peaks are broadened. 分散性好的胶体钯溶液的紫外-可见吸收峰变宽,经过活化可以进行直接电镀。
- Cholride ions in acid copper plating bath were determined by nephelometry with OP emulsifier as stabilizer. 利用比浊法,以OP乳化剂作为稳定剂测定酸性镀铜液中的氯离子。
- Using multi-grade potentiometry to decompose hazardous formic acid in chemical copper plating liquid into CO... 对化学镀铜液中有害的甲酸用多级电位法,使分解为碳酸气与氢。对亚磷酸用过氧化氢氧化为磷酸后呈钙盐去除。
- Electroless copper plating on PET fabrics using hypophosphite as reducing agent was investigated. 研究了采用次磷酸钠作还原剂在涤纶织物上化学镀铜。
- Electroless copper plating is a non-electrolytic method of deposition from solution. 化学镀铜是指不使用电解方法而从槽液中沉积镀铜。
- A new practical process of alkaline non-cyanide copper plating for preventing carburization was introduced. 介绍了一种实用性防渗碳无氰碱性镀铜新工艺,先进行预镀铜,再进行柠檬酸盐镀铜。
- The process flow and conditions of roughening by copper plating for wrought rolled copper foil were introduced. 介绍了压延铜箔镀铜粗化工艺的工艺流程和工艺条件。
- Specific monoamine may be added as accelerator into electroless copper plating solution to perform high speed deposition. 在化学镀铜液中添加有特效的一元胺作加速剂可以获得特别快的沉积速度.
- This non sequitur invalidates his argument. 他不根据前提推理因而论证无效。
