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- Results show that the induced thermal stress in MCM substrates is highly sensitive to their heating histories as well as the flow fields that develop inside the furnace. 结果显示MCM元件所引发的热张力相当易受热炉内加热历史、流场与热场的影响。
- The problems of temperature rise and thermal stress damage of semiconductors material induced by chemical laser beam are studied by using a numerical and analytical method. 分别采用数值方法与解析方法,研究了连续波激光辐照半导体材料时产生的温升及热应力。
- What kinds of thermal stress are there in the reactor? 在反应堆里有哪一种热应力?
- Conduct material Fatigue Testing and Thermal stress test. 进行材料疲劳测试和热应力测试。
- The time response characteristics of negative nonlinear intercalation photoswitch are discussed based on the photo induced thermal effect. 根据光致热效应讨论了负非线性夹层式光开关的时间响应特性。
- The result shows that the plastic strain at the heel region induced by wire bonding process, molding process and the thermal stress and strain in solder reflow are the main causes of heel crack. 结果显示由于引线键合工艺、注塑工艺以及回流焊中封装体各部分不同的热膨胀系数引起的热应力和塑性变形是产生引脚跟断裂的主要因素。
- neutron induced nuclear reaction 中子核反应
- Study on Modeling of Rotor Thermal Stress with Varying Coefficients. 汽轮机转子热应力自适应模型研究。
- Thermal Stresses Due to Temperature Transients. 温度转变引起的热压力。
- The thermal stress can be mitigated effectively when P is 1 and n is 6. 随着梯度层数的增加, 热工作热应力的最大值逐渐减小, 但当梯度层数达到6时, 随着梯度层数的增加, 缓和效果并不明显;
- These withstand heavy loads and thermal stresses well. 它们能很好地耐受重负荷和热应力。
- Both transient and steady-state thermal stress can be determined by this procedure. 瞬态和稳态的热应力均可用这种方法测定。
- The progress of thermal stress analysis of the FGM is reviwed and the development trends in this area are prospected in this paper. 回顾了近年来梯度功能材料(FGM)热应力研究领域所取得的研究成果,并对FGM热应力研究的发展趋势作一展望。
- In this paper,the progress of thermal stress analysis of the FGM is reviewed and the development trends in this area are prospected. 回顾了近年来梯度功能材料(FGM)热应力研究领域所取得的研完成果,并展望了FGM热应力研究的发展趋势。
- Beeaase it can remit thermal stress, FGM is ideal thermal resistant and heat isolating material for future spacecraft. 这种材料由于能够缓和热应力,是未来航天飞机器用的理想耐热、隔热材料。
- The fragmentation which induces thermal expansion can be neglected after the main devolatilization. 主要挥发分析出后热膨胀引起的破碎可以忽略。
- Thermal stress is bigger at bottom and on the top of building, and thermal stress is less in the middle of building. 温度应力总是在建筑物底层和顶部几层的应力较大,而建筑中部楼层的温度应力较小。
- Thermal stress of frame structures whose plane is arc was analysized and compared with that whose plane is ring. 对弧形框架在均匀温差作用下的温度应力进行了计算分析,并与圆环框架结构进行对比,总结其温度应力特点。
- As CTE mismatch of materials,it is possible that chips crack in thermal stress lumped rigion. 并且由于环氧模塑封材料、芯片之间的热膨胀系数失配,芯片热应力集中区域有发生脱层开裂的可能性。
- Then,the temperature field is loaded in FEA software to predict thermal stress and deformation. 并以此温度场为边界条件,利用FEA软件计算了机体热应力和热变形。