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- Development on Preparation for Nanocrystalline Copper Powder 纳米铜粉的制备进展
- nanocrystalline copper powders 纳米铜粉
- nanocrystalline copper powder 纳米铜粉
- Cu-Ag Bimetallic powers which were similar to the copper powders, were prepared by substitutional reaction method. 采用化学置换反应法制备铜-银双金属粉末。
- Nickel plat copper powders were prepared by electrolytic plating and bulk sinters of nickel-coated copper powders were prepared by sintering. 用化学镀法制备了镍包铜粉,并利用固相烧结法将镍包铜粉成功地制成了块状烧结体。
- The CAS Metal Institute discovered for the first time in the world the superplastic extensibility of nanocrystalline copper at room temperature, making a significant breakthrough in the NM science. 中科院金属所在世界上首次观察到纳米金属材料室温下的超塑延展性，在纳米科学领域取得重大突破。
- Nanometer copper powders were prepared from acidic waste etching solution containing copper using hydrazine hydrate as a reductive agent. 以酸性蚀刻废液为铜源,水合肼为还原剂,采用液相还原法制备纳米铜粉。
- Copper conductive adhesive is prepared by using modified resins and mixed resins as cohesive materials and Copper powders as conductive fillers. 以改性树脂和混合树脂为粘料，铜粉为导电性填料，并配以适当添加剂、固化剂制备铜导电胶。
- The tribological properties and the anti-wear of micron copper powder in greases are investigated by four-ball test. 通过四球试验,考察了微米铜粉在润滑脂中的摩擦学行为和抗磨性。
- During the electrolytic process, ultrasound is introduced to produce nanometer copper powder. 在一定的电解工艺条件下,引入超声波成功制备出纳米铜粉。
- A new type of copper powder separator is presented, which serves to separate the copper powders produced during the wire drawing process from the drawing lubricant. 介绍一种新型的铜粉分离装置,可利用液体旋转产生离心力的原理,将拉制铜线时产生的铜粉从润滑液中分离出来。
- The methods for preparing ultrafine copper powder are described with their advantages and disadvantages given.The developments of these methods are predicted. 阐述了目前制备超细铜粉的方法和工艺,并且对每种方法进行了分析,并就目前的问题提出了展望。
- This paper studies oxidation resistance process of using buffer-corrosive on copper powder and finds the best kind and dosage of buffer-corrosive. 研究了使用缓蚀剂对铜粉进行抗氧化处理的工艺,获得了处理效果最好的缓蚀剂类型及最佳使用剂量。
- We get the conclusion that the microstructure evolution of electrolytic copper powder and atomizing copper powder was different in SPS process. 得到电解铜粉和雾化铜粉在SPS烧结过程中显微组织演变特徵和规律不同的结论。
- Abstract: The article discusses the dimension control mechanism of ultra - fine copper powder in the preparation of electrodeposit. 文章摘要: 本文探讨了电沉积过程中超细铜粉的粒径控制机制。
- Ultrafine copper powder was prepared using hydrazine hydrate as reducing agent and ammonia water as the complexing agent. 以氨水作为络合剂,使用水合肼作为还原剂制备超细铜粉,通过正交实验确定最优工艺。
- Noriaki,Y Joei,M Takeo.Process for the production of a silver coated copper powder and conductive coating composition[P].US:4 652 465,1987-5-24. 梁浩;解芳.;镀银铜粉导电填料对复合型导电涂料性能影响的研究[J]
- The process and application of low apparent density Copper powder produced by atomization and oxidization-reduction have been introduced in this paper. 作者采用水雾化经氧化、还原等后续处理工艺研制生产了低松装密度雾化铜粉。本文主要介绍其生产工艺及应用结果。
- In the study on additive, metal powder including superfine nickel powder(T210 and 125 5),copper powder and nickel fiber, acetylene black and cobalt oxide(CoO) were involved. 研究了超细镍粉、铜粉、镍纤维、乙炔黑和CoO等添加剂对镍氢电池负极电化学性能的影响。
- NANOCRYSTALLINE COPPER WITH A SUPERPLASTIC EXTENSIBILITY AT ROOM TEMPERATURE 具有室温超塑延展性的纳米晶体铜
