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- Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Boards 多层印制线路板的选择芯结构指南
- Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications 多层印制板用芯板结构选择导则
- multilayer printed wiring board 多层印刷布线板
- Do the printed wiring boards have to be lead-free? 印刷线路板必须是无铅的吗?
- In the multilayer printed circuit boards (PCBs), the through-hole via transitions are always utilized to link the signal traces between different layers. 在多层印刷电路板当中,连通柱结构总是被用来连结位于不同层的传输线。
- Estimates are that 60-70% of printed wiring boards are tin-lead solder coated, usually by hot air solder leveling (HASL). 据估计,60-70%25的印刷线路板都带有锡-铅涂层,该涂层通常借助热空气焊料均涂(HASL)方法进行涂敷。
- In dielectrics are available on the electrical connections between components of conducting a graphic that is referred to as printed wiring. 在绝缘基材上提供元器件之间电气连接的导电图形,称为印制线路。
- Part 2 : specifications.Specification number 17 : thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board. 印刷电路用基材.;第2部分:规范
- Further, since the chip capacitors (20) are received in a thick core board (30), there is no possibility of thickening the printed wiring board. 另外,因为在厚的核心基板30中容纳了片状电容器20,所以印刷布线板不会变厚。
- The solder coatings are applied to the copper surfaces of the printed wiring board to preserve solderability and protect the copper conductors from environmental corrosion. 焊料涂层被涂敷到印刷线路板的铜表面上,不仅可以保持可焊性,同时还可以保护铜导体免受环境腐蚀。
- It is easier to print wire services dispatches than have a reporter on the beat. 刊登通讯社的电讯稿比派记者到现场采访要容易。
- SMPB Sequential Multilayer Printed Board 多层印制板
- Lamination Process of Multilayer Printed Board 多层板压合制程
- Microstrip multilayer printed circuit board 微带板
- flexible multilayer printed board 挠性多层印制板
- multilayer printed circuit board 多层印刷电路板,多层印制板
- flex-rigid multilayer printed board 刚-挠多层印制板
- Enthone manufactures, markets and distributes its functional, decorative and electronic processes that are used in printed wiring board (PWB), semiconductor, automotive, aerospace, jewelry, and hardware and plumbing applications. 乐思生产并销售其功能性、装饰性及电子电镀工艺,这些工艺适用于印刷电路板、半导体、汽车、航空、珠宝、五金及卫浴等工业。。
- Arranging chip capacitors (20) in a printed wiring board (10) makes it possible to reduce the distance between an IC chip (90) and the chip capacitor (20) and to reduce the loop inductance. 因为在印刷布线板10内设置了片状电容器20,所以能够缩短IC芯片90与片状电容器20的距离,降低环线电感。
- DC POWER BUS DECOUPLING ON MULTILAYER PRINTED CIRCUIT BOARD(PCB) 多层印制电路板电源去耦的研究