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- A comparison of Moire interferometry with real time observation Moire interferometry is also made. 并对贴片云纹干涉法和实时观测云纹干涉法进行比较。
- For the first time, the moire interferometry is applied to measure the displacement field for composite joints with a pinhole. 本研究首次将云纹干涉法应用于复合材料单销钉连接件位移场的测量。
- The reflective high sensitivity moire interferometry was applied to measure out of plane displacement fields in ferroelectric ceramics. 文章采用反射式高灵敏度离面云纹干涉法测量了铁电陶瓷的离面位移。
- HRR-dominace and the application feasibility of J -integral in heterogeneous welded joints is investigated by Moire interferometry of reflected sticking film. 采用反射式贴片云纹干涉法对焊接接头裂纹尖端位移场进行了测量,并考察了非均质焊接接头中的HRR主导有效性与J积分断裂判据的应用可行性。
- The high temperature creep deformation of certain material used in aerial engines lamina was detected by means of high temperature moire interferometry in this paper. 利用高温云纹干涉法对航空发动机叶片定向结晶材料的高温蠕变进行了测试,获得该材料不同主方向的高温蠕变性质和规律。
- Investigated stresses were relieved by cutting specimens along a radial direction, and additional strain fields created by relieving the stresses were measured using moire interferometry. 沿着径向将试件切割,以释放欲测的应力,同时用干涉云纹技术测量由于释放应力而引起的附加应变场。
- An experimental light path of real time moire interferometry with a purpose-made holographic grating is developed,which is vibrationproof and is suitable for non-vibration isolation condition. 本文提出一有特制的全息光栅参与组成的具有强抗干扰能力、适用于非隔振条件下实时云纹干涉法试验光路,并详述了它的原理和特点。
- carrier fringe of Moiré interferometry 云纹干涉载波条纹
- The fiber optic Moire interferometric 3-D profilometry has been developed in this paper. 本论文研究了光纤莫尔干涉三维轮廓术。
- Keywords Moire Interferometry;Laminated Glass;Thermal Strain; 云纹干涉法;层合玻璃;热应变;
- An Experimental Study on Creep Behavior of PBX using Moire Interferometry PBX材料蠕变性能的云纹干涉法实验研究
- Keywords moire interferometry;functionally graded material;strain;thermal load; 云纹干涉法;梯度功能材料;应变;热载荷;
- Keywords moire interferometry;orthotropic materials;stress intensity factor; 云纹干涉法;正交异性材料;应力强度因子;
- In-situ Moire Interferometry Technique and ts Applications to Microelectronic Packages 云纹干涉法现场测量技术及其在微电子封装中的应用
- Keywords laser moire interferometry;micro multiplication;Ti;SCC;facilitation of deformation by anodic dissolution; 云纹干涉;显微倍增;工业纯钛;应力腐蚀;溶解促进塑性变形;
- Keywords moire interferometry;thermal replicate technique;thermal stress of a bimaterial in interface; 云纹干涉技术;热复制变形栅技术;双材料界面热应力;
- Keywords Moire Interferometry;Composite Material;Electronic Packaging;High Temperature Creep Strain;Welding Stress; 云纹干涉法;复合材料;微电子封装;高温蠕变;焊接应力;
- Keywords sticking film moire interferometry;orthotropic material;stress-intensity factor; 贴片云纹干涉;正交异性材料;应力强度因子;
- An Experimental Research on Measuring Fracture Toughness for High-Temperature Metallic Material by Laser Moire Interferometry 激光全息云纹干涉法测定高温合金材料断裂特性的试验研究
- A Study on the Variation of Effective CTE of Printed Circuit Boards through a Validated Comparison between Strain Gages and Moire Interferometry 采用张力测量和莫尔条纹干涉测量印制板热膨胀系数变化的比较研究在微电子封装中印制板热膨胀系数